UPD70F3735GC-GAD-AX Renesas Electronics America, UPD70F3735GC-GAD-AX Datasheet - Page 766

• Manufacturer Part Number: UPD70F3735GC-GAD-AX
• Description: MCU 32BIT V850ES/JX3-L 80-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Jx3-Lr

Specifications of UPD70F3735GC-GAD-AX

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 20MHz
• Connectivity: CSI, EBI/EMI, I²C, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 66
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 8x10b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

V850ES/JF3-L
29.2.4 Cautions
R01UH0017EJ0400 Rev.4.00
Sep 30, 2010
(1) Handling of device that was used for debugging
(2) When breaks cannot be executed
(3) When pseudo real-time RAM monitor (RRM) function and DMM function do not operate
(4) Standby release with pseudo RRM and DMM functions enabled
(5) Writing to peripheral I/O registers that requires a specific sequence, using DMM function
(6) Flash self programming
(7) Voltage for on-chip debugging
• Interrupts are disabled (DI)
• Interrupts issued for the serial interface, which is used for communication between MINICUBE2 and the target
• Standby mode is entered while standby release by a maskable interrupt is prohibited
• Mode for communication between MINICUBE2 and the target device is UARTA0, and the main clock has been
• Interrupts are disabled (DI)
• Interrupts issued for the serial interface, which is used for communication between MINICUBE2 and the target
• Standby mode is entered while standby release by a maskable interrupt is prohibited
• Mode for communication between MINICUBE2 and the target device is UARTA0, and the main clock has been
• Mode for communication between MINICUBE2 and the target device is UARTA0, and a clock different from the
• Mode for communication between MINICUBE2 and the target device is CSIB0
• Mode for communication between MINICUBE2 and the target device is UARTA0, and the main clock has been
Do not mount a device that was used for debugging on a mass-produced product, because the flash memory was
rewritten during debugging and the number of rewrites of the flash memory cannot be guaranteed. Moreover, do
not embed the debug monitor program into mass-produced products.
Forced breaks cannot be executed if one of the following conditions is satisfied.
The pseudo RRM function and DMM function do not operate if one of the following conditions is satisfied.
The standby mode is released by the pseudo RRM function and DMM function if one of the following conditions is
satisfied.
Peripheral I/O registers that requires a specific sequence cannot be written with the DMM function.
If a space where the debug monitor program is allocated is rewritten by flash self programming, the debugger can
no longer operate normally.
On-chip debugging can be used when the supply voltage (V
less than 2.7 V.
device, are masked
stopped
device, are masked
stopped
one specified in the debugger is used for communication
supplied.
DD
CHAPTER 29 ON-CHIP DEBUG FUNCTION
) is in a range of 2.7 to 3.6 V. It cannot be used at
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