UPD70F3735GC-GAD-AX Renesas Electronics America, UPD70F3735GC-GAD-AX Datasheet - Page 801

• Manufacturer Part Number: UPD70F3735GC-GAD-AX
• Description: MCU 32BIT V850ES/JX3-L 80-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Jx3-Lr

Specifications of UPD70F3735GC-GAD-AX

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 20MHz
• Connectivity: CSI, EBI/EMI, I²C, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 66
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 8x10b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

V850ES/JF3-L
(1)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remarks 1. The V850ES/JF3-L is lead-free products.
R01UH0017EJ0400 Rev.4.00
Sep 30, 2010
Soldering Method
Infrared reflow
Partial heating
The V850ES/JF3-L should be soldered and mounted under the following recommended conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www2.renesas.com/pkg/en/mount/index.html)
μ
μ
μ
μ
PD70F3735GK-GAK-AX:
PD70F3736GK-GAK-AX:
PD70F3735GC-GAD-AX:
PD70F3736GC-GAD-AX:
2. For soldering methods and conditions other than those recommended above, please contact an Renesas
Electronics sales representative.
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: Three times or less, Exposure limit: 7 days
to 72 hours)
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
CHAPTER 32 RECOMMENDED SOLDERING CONDITIONS
Table 32-1. Surface Mounting Type Soldering Conditions
80-pin plastic LQFP (fine pitch) (12 × 12)
80-pin plastic LQFP (fine pitch) (12 × 12)
80-pin plastic LQFP (14 × 14)
80-pin plastic LQFP (14 × 14)
Soldering Conditions
CHAPTER 32 RECOMMENDED SOLDERING CONDITIONS
Note
(after that, prebake at 125°C for 20
IR60-207-3
Condition Symbol
Recommended
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