LPC1857FET256,551 NXP Semiconductors, LPC1857FET256,551 Datasheet - Page 12
LPC1857FET256,551
Manufacturer Part Number
LPC1857FET256,551
Description
IC MCU 32BIT 1MB FLASH 256LBGA
Manufacturer
NXP Semiconductors
Series
LPC18xxr
Datasheets
1.LPC1830FET256551.pdf
(87 pages)
2.LPC1810FET100551.pdf
(2 pages)
3.LPC1810FET100551.pdf
(1164 pages)
Specifications of LPC1857FET256,551
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, SD/MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
136K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-LBGA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1857FET256,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
- Current page: 12 of 1164
- Download datasheet (8Mb)
NXP Semiconductors
1.6 Block diagram (parts with on-chip flash)
<Document ID>
User manual
Fig 3.
(1) Not available on all parts (see
BRIDGE 0
USART0
TIMER0
TIMER1
WWDT
UART1
SWD/TRACE PORT/JTAG
SSP0
LPC185x/3x/2x/1x block diagram (parts with on-chip flash)
SCU
CORTEX-M3
TEST/DEBUG
INTERFACE
ARM
= connected to GPDMA
CONTROL
BRIDGE 1
C_CAN1
MOTOR
PWM
I
I
I
2
2
2
C0
S0
S1
GPDMA
BRIDGE 2
RI TIMER
USART2
USART3
TIMER2
TIMER3
SSP1
Table
QEI
AHB MULTILAYER MATRIX
All information provided in this document is subject to legal disclaimers.
4).
ETHERNET
IEEE 1588
10/100
MAC
10-bit ADC0
10-bit ADC1
BRIDGE 3
10-bit DAC
Rev. 00.13 — 20 July 2011
C_CAN0
I
2
(1)
HIGH-SPEED PHY
C1
DEVICE/
USB0
SPEED
HOST/
HIGH-
OTG
(1)
BRIDGE
CCU1
CCU2
CGU
RGU
USB1
DEVICE
HOST/
(1)
POWER MODE CONTROL
BACKUP REGISTERS
RTC
CONFIGURATION
EVENT ROUTER
RTC POWER DOMAIN
LCD
ALARM TIMER
OTP MEMORY
REGISTERS
12 MHz IRC
BRIDGE
(1)
Chapter 1: Introductory information
RTC OSC
slaves
MMC
SD/
(1)
masters
LPC185x/3x/2x/1x
32 kB LOCAL SRAM
16 +16 kB AHB SRAM
40 kB LOCAL SRAM
32 kB AHB SRAM
512 kB FLASH
512 kB FLASH
UM10430
32 kB ROM
slaves
© NXP B.V. 2011. All rights reserved.
HS GPIO
SGPIO
SPIFI
EMC
SCT
AES
SPI
(1)
(1)
12 of 1164
(1)
Related parts for LPC1857FET256,551
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet: