mt46h8m16lfcf-75-it Micron Semiconductor Products, mt46h8m16lfcf-75-it Datasheet - Page 5

• Manufacturer Part Number: mt46h8m16lfcf-75-it
• Description: 128mb Mobile Ddr Sdram Mt46h4m32lfb5-6
• Manufacturer: Micron Semiconductor Products

Figure 1:
FBGA Part Marking Decoder
General Description
PDF: 09005aef8331b3e9 / Source: 09005aef8331b3ce
128mb_mobile_ddr_sdram_t35m__2.fm - Rev. B 06/08 EN
Micron Technology
Product Family
46 = Mobile DDR SDRAM
Operating Voltage
H = 1.8/1.8V
Configuration
8 Meg x 16
4 Meg x 32
Addressing
LF = Mobile standard addressing
128Mb Mobile DDR Part Numbering
Notes:
1. Throughout the data sheet, the various figures and text refer to DQs as “DQ.” The DQ
2. Complete functionality is described throughout the document and any page or dia-
3. Any specific requirement takes precedence over a general statement.
Due to space limitations, FBGA-packaged components have an abbreviated part
marking that is different from the part number. Micron’s FBGA Part Marking Decoder is
available at www.micron.com/decoder.
The 128Mb Mobile DDR SDRAM is a high-speed CMOS, dynamic random-access
memory containing 134,217,728 bits. It is internally configured as a quad-bank DRAM.
Each of the x16’s 33,554,432-bit banks is organized as 4,096 rows by 512 columns by 16
bits. Each of the x32’s 33,554,432-bit banks is organized as 4,096 rows by 256 columns by
32 bits.
term is to be interpreted as any and all DQ collectively, unless specifically stated
otherwise. Additionally, the x16 is divided into two bytes: the lower byte and the upper
byte. For the lower byte (DQ[7:0]), DM refers to LDM and DQS refers to LDQS. For the
upper byte (DQ[15:8]), DM refers to UDM and DQS refers to UDQS. The x32 is divided
into four bytes. For DQ[7:0], DM refers to DM0 and DQS refers to DQS0. For DQ[15:8],
DM refers to DM1 and DQS refers to DQS1. For DQ[23:16], DM refers to DM2 and
DQS refers to DQS2, and for DQ[31:24], DM refers to DM3 and DQS refers to DQS3.
gram may have been simplified to convey a topic and may not be inclusive of all
requirements.
MT 46
H
8M16
LF BF
5
-6
Micron Technology, Inc., reserves the right to change products or specifications without notice.
128Mb: x16, x32 Mobile DDR SDRAM
IT
:K
FBGA Part Marking Decoder
Revision
:K
Operating Temperature
Blank = Commercial (0°C to +70°C)
IT = Industrial (–40°C to +85°C)
Cycle Time
-5 = 5ns
-54 = 5.4ns
-6 = 6ns
-75 = 7.5ns
Package Codes
BF = 8mm x 9mm VFBGA “green”
B5 = 8mm x 13mm VFBGA “green”
t
t
CK CL = 3
CK CL = 3
t
t
CK CL = 3
CK CL = 3
©2007 Micron Technology, Inc. All rights reserved.
Preliminary