AT86RF212-ZU Atmel, AT86RF212-ZU Datasheet - Page 151

• Manufacturer Part Number: AT86RF212-ZU
• Description: IC TXRX ZIGBE/802.15.4/ISM 32QFN
• Manufacturer: Atmel

Specifications of AT86RF212-ZU

• Frequency: 700MHz, 800MHz, 900MHz
• Data Rate - Maximum: 250kbps
• Modulation Or Protocol: 802.15.4 Zigbee, 6LoWPAN, ISM
• Applications: ISM, ZigBee™
• Power - Output: 10dBm
• Sensitivity: -110dBm
• Voltage - Supply: 1.8 V ~ 3.6 V
• Current - Receiving: 9.2mA
• Current - Transmitting: 25mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-VQFN Exposed Pad, 32-HVQFN, 32-SQFN, 32-DHVQFN
• Number Of Receivers: 1
• Number Of Transmitters: 1
• Wireless Frequency: 769 MHz to 935 MHz
• Interface Type: SPI
• Noise Figure: 7 dB
• Output Power: 21 dB
• Operating Supply Voltage: 1.8 V, 3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Maximum Supply Current: 25 mA
• Minimum Operating Temperature: - 40 C
• Modulation: OQPSK
• Protocol Supported: 802.15.4
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

10.4 Digital Interface Timing Characteristics
8168C-MCU Wireless-02/10
No.
10.4.1
10.4.2
10.4.3
10.4.4
10.4.5
10.4.6
10.4.7
10.4.8
10.4.9
10.4.10
10.4.11
10.4.12
10.4.13
10.4.14
10.4.15
10.4.16
10.4.17
Symbol
f
f
t
t
t
t
t
t
t
t
t
t
t
t
t
f
t
sync
async
1
2
3
4
5
6
7
8
9
10
11
12
13
CLKM
IRQ
Parameter
SCLK frequency
SCLK frequency
/SEL falling edge to MISO active
SCLK falling edge to MISO out
MOSI setup time
MOSI hold time
LSB last byte to MSB next byte
/SEL rising edge to MISO tri state
SLP_TR pulse width
SPI idle time between
consecutive SPI accesses:
SEL rising to falling edge
SCLK rising edge LSB to /SEL
rising edge
Reset pulse width
SPI access latency after reset
AES core cycle time
Dynamic frame buffer protection:
IRQ latency
Clock frequency at pin 17
(CLKM)
IRQ_2, IRQ_3, IRQ_4 latency
Test Conditions: T
Note:
1. The capacitive load should not be larger than 50 pF for all I/Os when using the
default driver strength settings, refer to section 2.2.2.1. Generally, large load
capacitances increase the overall current consumption.
Condition
Synchronous operation
Asynchronous operation
Data hold time
SPI read/write, standard SRAM
and frame access modes
Fast SRAM read/write access
mode, refer to section 9.1.5
TX start trigger
SPI read/write, standard SRAM
and frame access modes
Fast SRAM read/write access
mode, refer to section 9.1.5
≥ 10 clock cycles at 16 MHz
≥ 10 clock cycles at 16 MHz
Programmable via
register 0x03 (TRX_CTRL_0)
Relative to the event to be
indicated
OP
= 25 °C, V
DD
= 3.0 V, C
L
= 50 pF
250
500
250
500
25
10
10
Min.
62.5
625
625
(7)
(7)
(7)
(8)
(8)
(8)
(8)
1/50
1/25
1/40
1/16
250
1/4
16
Typ.
750
0
1
2
4
8
9
24
(2)
(2)
(2)
(2)
(2)
(9)
(2)
(2)
(8)
(3)
(4)
(5)
(6)
AT86RF212
Note
180
Max.
10
7.5
8
(8)
(7)
(1)
Units
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
µs
ns
µs
151