ADSP-21364SBBCZENG AD [Analog Devices], ADSP-21364SBBCZENG Datasheet - Page 44

• Manufacturer Part Number: ADSP-21364SBBCZENG
• Description: SHARC Processor
• Manufacturer: AD [Analog Devices]

ADSP-21364
THERMAL CHARACTERISTICS
The ADSP-21364 processor is rated for performance to a maxi-
mum junction temperature of 125°C.
Table 39
JESD51-2 and JESD51-6 and the junction-to-board measure-
ment complies with JESD51-8. Test board and thermal via
design comply with JEDEC standards JESD51-9 (Mini-BGA)
and JESD51-5 (Integrated Heatsink LQFP). The junction-to-
case measurement complies with MIL- STD-883. All measure-
ments use a 2S2P JEDEC test board.
Industrial applications using the Mini-BGA package require
thermal vias, to an embedded ground plane, in the PCB. Refer to
JEDEC Standard JESD51-9 for printed circuit board thermal
ball land and thermal via design information. Industrial applica-
tions using the LQFP package require thermal trace squares and
thermal vias, to an embedded ground plane, in the PCB. The
bottom side heat slug must be soldered to the thermal trace
squares. Refer to JEDEC Standard JESD51-5 for more
information.
To determine the Junction Temperature of the device while on
the application PCB, use:
where:
T
T
the package
Ψ
is the Typical value from
P
Values of θ
design considerations. θ
mation of T
D
J
CASE
JT
= Junction temperature ×C
= Power dissipation (see EE Note #216)
= Junction-to-Top (of package) characterization parameter
Figure 41. Typical Output Delay or Hold vs. Load Capacitance
= Case temperature (×C) measured at the top center of
10
-4
-2
8
6
4
2
0
airflow measurements comply with JEDEC standards
0
JA
J
by the equation:
are provided for package comparison and PCB
Y = 0.0488X - 1.5923
T
J
(at Ambient Temperature)
=
50
LOAD CAPACITANCE (pF)
T
JA
Table 39
CASE
can be used for a first order approxi-
+
(
and
100
Ψ
JT
Table
×
P
D
)
41.
150
Rev. PrB | Page 44 of 52 | September 2004
200
where:
T
Values of θ
design considerations when an external heatsink is required.
Values of θ
design considerations.
Table 39. Thermal Characteristics for 136 Ball Mini-BGA
(No thermal vias in PCB)
Table 40. Thermal Characteristics for 136 Ball Mini-BGA
(Thermal vias in PCB)
Table 41. Thermal Characteristics for 144-Lead Integrated
Heatsink (INT–HS) LQFP (With heat slug not soldered to
PCB)
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
A
JA
JMA
JMA
JC
JA
JMA
JMA
JC
JA
JMA
JMA
JC
JT
JMT
JMT
JT
JMT
JMT
JT
JMT
JMT
= Ambient Temperature
1
JC
JB
are provided for package comparison and PCB
are provided for package comparison and PCB
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Preliminary Technical Data
T
J
1
=
1
T
A
0
C
+
(
θ
JA
×
P
D
Typical
25.20
21.70
20.80
5.00
0.140
0.330
0.410
Typical
22.50
19.30
18.40
5.00
0.130
0.300
0.360
Typical
26.08
24.59
23.77
6.83
0.236
0.427
0.441
)
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W