ADSP-21364SBBCZENG AD [Analog Devices], ADSP-21364SBBCZENG Datasheet - Page 50

• Manufacturer Part Number: ADSP-21364SBBCZENG
• Description: SHARC Processor
• Manufacturer: AD [Analog Devices]

ADSP-21364
PACKAGE DIMENSIONS
The ADSP-21364 is available in a 136-ball Mini-BGA package
and a 144-lead integrated heatsink LQFP package.
MAX
1.70
1. DIMENSIONS ARE IN MILIMETERS (MM).
2. THE ACTUAL POSITION OF THE BALL GRID IS
3. THE ACTUAL POSITION OF EACH BALL IS WITHIN 0.08 MM
4. COMPLIANT TO JEDEC STANDARD MO-205-AE, EXCEPT FOR
5. CENTER DIMENSIONS ARE NOMINAL.
WITHIN 0.15 MM OF ITS IDEAL POSITION RELATIVE
TO THE PACKAGE EDGES.
OF ITS IDEAL POSITION RELATIVE TO THE BALL GRID.
THE BALL DIAMETER.
PIN A1 INDICATOR
12.00 BSC SQ
TOP VIEW
Rev. PrB | Page 50 of 52 | September 2004
Figure 43. 136-Ball Mini-BGA (BC-136-2)
DETAIL A
BSC
BSC
0.80
0.80
TYP
TYP
0.25
MIN
G
M
A
B
C
D
E
F
H
J
K
L
N
P
14
DIAMETER)
13
(BALL
12
0.45
0.50
0.40
11
BOTTOM VIEW
10.40 BSC SQ
10 9 8 7 6 5 4 3 2 1
DETAIL A
Preliminary Technical Data
0.12 MAX (BALL
COPLANARITY)
SEATING
PLANE
0.80
BSC
TYP