MCIMX53-START Freescale Semiconductor, MCIMX53-START Datasheet - Page 18

• Manufacturer Part Number: MCIMX53-START
• Description: KIT DEVELOPMENT I.MX53
• Manufacturer: Freescale Semiconductor
• Series: i.MX53r
• Type: MCUr

Specifications of MCIMX53-START

• Contents: Board
• Silicon Manufacturer: Freescale
• Core Architecture: ARM
• Core Sub-architecture: Cortex - A8
• Silicon Core Number: I.MX5
• Silicon Family Name: I.MX53
• Peak Reflow Compatible (260 C): Yes
• Rohs Compliant: Yes
• Leaded Process Compatible: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: i.MX53
• Lead Free Status / Rohs Status: Supplier Unconfirmed

Electrical Characteristics
4.1.2
Table 5
18
1
2
1
2
3
Peripheral Core Supply Voltage
ARM Core Supply Voltage
Supply Voltage UHVIO
Supply Voltage for non UHVIO
USB VBUS
Input voltage on USB_OTG_DP, USB_OTG_DN,
USB_H1_DP, USB_H1_DN pins
Input/Output Voltage Range
ESD Damage Immunity:
Storage Temperature Range
Junction to Ambient (natural convection)
Junction to Ambient (natural convection)
Junction to Ambient (@200 ft/min)
Junction to Ambient (@200 ft/min)
Junction to Board
Junction to Case
Junction to Package Top (natural convection)
USB_DN and USB_DP can tolerate 5 V for up to 24 hours.
The term OVDD in this section refers to the associated supply rail of an input or output. The association is described in
Table 110 on page
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
Per JEDEC JESD51-6 with the board horizontal.
provides the package thermal resistance data.
Thermal Resistance
Parameter Description
5
4
157. The maximum range can be superseded by the DC tables.
Charge Device Model (CDM)
Human Body Model (HBM)
Rating
i.MX53xD Applications Processors for Consumer Products, Rev. 1
1, 3
1, 3
Table 5. Package Thermal Resistance Data
1, 2
1, 2, 3
Table 4. Absolute Maximum Ratings
6
Supplies denoted as I/O Supply
Supplies denoted as I/O Supply
Single layer board
Single layer board
USB_DP/USB_DN
Four layer board
Four layer board
T
Board
Symbol
VDDGP
(2s2p)
(2s2p)
V
STORAGE
VBUS
(1s)
(1s)
VCC
in
V
—
—
—
/V
esd
out
Symbol
R
R
R
R
R
R
Ψ
θJMA
θJMA
θJC
θJA
θJA
θJB
JT
–0.3
–0.3
–0.5
–0.5
–0.3
–0.5
Min
–40
—
—
—
Value
Freescale Semiconductor
OVDD +0.3
28
16
21
13
6
4
4
3.63
2000
Max
1.35
1.35
5.25
500
150
3.6
3.3
1
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
o
V
V
V
V
V
V
V
V
C