MCIMX53-START Freescale Semiconductor, MCIMX53-START Datasheet - Page 31
MCIMX53-START
Manufacturer Part Number
MCIMX53-START
Description
KIT DEVELOPMENT I.MX53
Manufacturer
Freescale Semiconductor
Series
i.MX53r
Type
MCUr
Datasheets
1.MCIMX53-START.pdf
(2 pages)
2.MCIMX53-START.pdf
(180 pages)
3.MCIMX53-START.pdf
(204 pages)
Specifications of MCIMX53-START
Contents
Board
Silicon Manufacturer
Freescale
Core Architecture
ARM
Core Sub-architecture
Cortex - A8
Silicon Core Number
I.MX5
Silicon Family Name
I.MX53
Peak Reflow Compatible (260 C)
Yes
Rohs Compliant
Yes
Leaded Process Compatible
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With/related Products
i.MX53
Lead Free Status / Rohs Status
Supplier Unconfirmed
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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4.3.2.3
The DDR3 interface fully complies with JESD79-3D DDR3 JEDEC standard release April, 2008. The
parameters in
Freescale Semiconductor
DC input Low Voltage
Differential Input Logic High
Differential Input Logic Low
Input current (no pull-up/down)
240 Ohm unit calibration resolution
Keeper Circuit Resistance
High-level output voltage
Low-level output voltage
DC input Logic High
DC input Logic Low
Differential input Logic High
Differential input Logic Low
Over/undershoot peak
Over/undershoot area
(above OVDD or below OVSS)
Termination Voltage
Input current (no pull-up/down)
Pull-up/Pull-down impedance mismatch
240 Ω unit calibration resolution
Keeper Circuit Resistance
Note that the JEDEC LPDDR2 specification (JESD209_2B) supersedes any specification in this document.
The single-ended signals need to be within the respective limits (Vih(dc) max, Vil(dc) min) for single-ended signals as well as
the limitations for overshoot and undershoot.
Use an off-chip pull resistor of less than 60kΩ to override this keeper.
Pull-up/Pull-down impedance
Parameters
Mismatch
DDR3 Mode I/O DC Parameters
Table 13
3
Table 12. LPDDR2 I/O DC Electrical Parameters
i.MX53xD Applications Processors for Consumer Products, Rev. 1
are guaranteed per the operating ranges in
Table 13. DDR3 I/O DC Electrical Parameters
Vil(dc)
Vih(diff)
Vil(diff)
Iin
Symbol
VIH(diff)
VIL(diff)
VIH(dc)
VIL(dc)
Vpeak
Varea
Voh
Vol
Vtt
—
Iin
—
—
—
Minimum impedance
Vtt tracking OVDD/2
Test Conditions
VI=OVDD
VI = 0 V
configuration
VI=OVDD
VI = 0 V
—
—
—
—
—
—
—
—
—
—
—
—
See Note
OVSS
0.26
-15
0.49*OVDD
0.8*OVDD
Table
—
—
—
See Note
Vref
OVSS
Min
1
0.2
—
—
—
—
—
—
—
—
2
2
+0.1
(continued)
6, unless otherwise noted.
3
1
125
0.02
1.5
—
125
0.09
1.75
Vref
Typ
—
—
—
—
—
—
—
—
—
4
—
Electrical Characteristics
4
0.51*OVDD
Vref-0.13V
See Note
0.2*OVDD
See Note
Vref-0.1
OVDD
-0.26
12.8
290
+15
Max
0.67
-0.2
320
10
—
0.4
15
10
—
—
3
2
3
Unit
Ohm
V x
nS
nA
kΩ
kΩ
nA
Ω
Ω
V
V
V
V
V
V
V
V
%
V
31
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