MCIMX535DVV1C Freescale Semiconductor, MCIMX535DVV1C Datasheet - Page 18

• Manufacturer Part Number: MCIMX535DVV1C
• Description: IMX53 REV 2.1 COMM
• Manufacturer: Freescale Semiconductor

Specifications of MCIMX535DVV1C

• Rohs Compliant: YES
• Core Size: 32bit
• Program Memory Size: 288KB
• Cpu Speed: 1GHz
• Digital Ic Case Style: BGA
• No. Of Pins: 529
• Supply Voltage Range: 1.25V To 1.35V
• Operating Temperature Range: -20°C To +85°C
• Msl: MSL 3 - 168 Hours
• Embedded Interface Type: I2C, SPI, UART
• Lead Free Status / Rohs Status: Supplier Unconfirmed

Electrical Characteristics
4.1.2
4.1.2.1
Table 5
18
1
2
1
2
3
4
Supply Voltage UHVIO
Supply Voltage for non UHVIO
USB VBUS
Input voltage on USB_OTG_DP, USB_OTG_DN,
USB_H1_DP, USB_H1_DN pins
Input/Output Voltage Range
ESD Damage Immunity:
Storage Temperature Range
Junction to Ambient (natural convection)
Junction to Ambient (natural convection)
Junction to Ambient (at 200 ft/min)
Junction to Ambient (at 200 ft/min)
Junction to Board
Junction to Case
Junction to Package Top (natural convection)
• Human Body Model (HBM)
• Charge Device Model (CDM)
USB_DN and USB_DP can tolerate 5 V for up to 24 hours.
The term OVDD in this section refers to the associated supply rail of an input or output. The association is described in
Table 112 on page
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
provides the TEPBGA-2 package thermal resistance data.
Thermal Resistance
Parameter Description
TEPBGA-2 Package Thermal Resistance
5
4
154. The maximum range can be superseded by the DC tables.
Rating
i.MX53xD Applications Processors for Consumer Products, Rev. 3
Table 5. TEPBGA-2 Package Thermal Resistance Data
Table 4. Absolute Maximum Ratings (continued)
1, 3
1, 3
1, 2
1, 2, 3
6
Supplies denoted as I/O Supply
Supplies denoted as I/O Supply
Single layer board
Single layer board
USB_DP/USB_DN
Four layer board
Four layer board
T
Board
Symbol
(2s2p)
(2s2p)
V
STORAGE
VBUS
(1s)
(1s)
in
V
—
—
—
/V
esd
out
Symbol
R
R
R
R
R
R
Ψ
θJMA
θJMA
θJC
θJA
θJA
θJB
JT
–0.5
–0.5
–0.3
–0.5
Min
–40
—
—
—
Value
Freescale Semiconductor
OVDD +0.3
28
16
21
13
6
4
4
3.63
2000
Max
5.25
500
150
3.6
3.3
1
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
o
V
V
V
V
V
V
C