MCIMX535DVV1C Freescale Semiconductor, MCIMX535DVV1C Datasheet - Page 19

• Manufacturer Part Number: MCIMX535DVV1C
• Description: IMX53 REV 2.1 COMM
• Manufacturer: Freescale Semiconductor

Specifications of MCIMX535DVV1C

• Rohs Compliant: YES
• Core Size: 32bit
• Program Memory Size: 288KB
• Cpu Speed: 1GHz
• Digital Ic Case Style: BGA
• No. Of Pins: 529
• Supply Voltage Range: 1.25V To 1.35V
• Operating Temperature Range: -20°C To +85°C
• Msl: MSL 3 - 168 Hours
• Embedded Interface Type: I2C, SPI, UART
• Lead Free Status / Rohs Status: Supplier Unconfirmed

4.1.2.2
Table 6
Freescale Semiconductor
5
6
1
2
3
4
5
6
7
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
Junction to Ambient (natural convection)
Junction to Ambient (natural convection)
Junction to Ambient (at 200 ft/min)
Junction to Ambient (at 200 ft/min)
Junction to Board
Junction to Case
Junction to Package Top (natural convection)
Calculated for just the i.MX53xD package, without the top mounted memory package.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2.
provides the PoP package thermal resistance data.
PoP Package Thermal Resistance
6
5
Rating
i.MX53xD Applications Processors for Consumer Products, Rev. 3
Table 6. PoP Package Thermal Resistance Data
2, 4
2, 4
2, 3
2, 3, 4
7
Single layer board
Single layer board
Four layer board
Four layer board
Board
(2s2p)
(2s2p)
(1s)
(1s)
—
—
—
Symbol
R
R
R
R
R
R
Ψ
θJMA
θJMA
θJA
θJA
θJB
θJC
JT
designed
<0.1
8.4
As
45
23
36
19
2
1
used for
Array of
Ground
Electrical Characteristics
Center
Pillars
<0.1
7.2
45
22
35
18
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
19