UPD78F0138 NEC, UPD78F0138 Datasheet - Page 523

• Manufacturer Part Number: UPD78F0138
• Description: (UPD78xxxx) 8-Bit Single-Chip Microcontrollers
• Manufacturer: NEC

sales representative.
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Infrared reflow
VPS
Partial heating
Soldering Method
These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
(1) Mask ROM version (GB-8EU type)
64-pin plastic LQFP (10 × 10)
µ PD780131GB-
µ
µ
µ PD780134GB(A)-
µ
µ
µ
µ PD780134GB(A2)-
PD780134GB-
PD780131GB(A)-
PD780131GB(A1)-
PD780134GB(A1)-
PD780131GB(A2)-
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Twice or less, Exposure limit: 7 days
hours)
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Twice or less, Exposure limit: 7 days
hours)
CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS
×××
×××
Table 33-1. Surface Mounting Type Soldering Conditions (1/6)
×××
×××
-8EU, 780132GB-
-8EU, 780136GB-
×××
×××
×××
×××
-8EU, 780136GB(A)-
-8EU, 780132GB(A)-
-8EU, 780132GB(A1)-
-8EU, 780136GB(A1)-
-8EU, 780132GB(A2)-
-8EU, 780136GB(A2)-
×××
×××
User’s Manual U16228EJ2V0UD
-8EU, 780133GB-
-8EU, 780138GB-
Soldering Conditions
×××
×××
×××
×××
×××
×××
-8EU, 780138GB(A)-
-8EU, 780133GB(A)-
-8EU, 780133GB(A1)-
-8EU, 780138GB(A1)-
-8EU, 780133GB(A2)-
-8EU, 780138GB(A2)-
Note
Note
(after that, prebake at 125°C for 10
(after that, prebake at 125°C for 10
×××
×××
-8EU,
-8EU,
×××
×××
-8EU,
-8EU,
×××
×××
×××
×××
-8EU,
-8EU,
-8EU,
-8EU
IR35-107-2
VP15-107-2
Condition Symbol
Recommended
−
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