xq2vp40 Xilinx Corp., xq2vp40 Datasheet - Page 69

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xq2vp40

Manufacturer Part Number
xq2vp40
Description
Qpro Virtex-ii Pro 1.5v Platform Fpgas Complete Data Sheet
Manufacturer
Xilinx Corp.
Datasheet

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Output Delay Measurements
Output delays are measured using a Tektronix P6245
TDS500/600 probe (< 1 pF) across approximately 4" of FR4
microstrip trace. Standard termination was used for all
testing. (See Virtex-II Pro Platform FPGA User Guide for
details.) The propagation delay of the 4" trace is
characterized separately and subtracted from the final
measurement, and is therefore not included in the
generalized test setup shown in
Measurements and test conditions are reflected in the IBIS
models except where the IBIS format precludes it. (IBIS
models can be found on the web at
http://support.xilinx.com/support/sw_ibis.htm
V
conditions for each I/O standard. The most accurate
prediction of propagation delay in any given application can
be obtained through IBIS simulation, using the following
method:
1. Simulate the output driver of choice into the generalized
2. Record the time to V
Table 24: Output Delay Measurement Methodology
DS136-3 (v2.0) December 20, 2007
Preliminary Product Specification
LVTTL (Low-Voltage Transistor-Transistor Logic)
LVCMOS (Low-Voltage CMOS), 3.3V
LVCMOS, 2.5V
LVCMOS, 1.8V
LVCMOS, 1.5V
PCI (Peripheral Component Interface), 33 MHz, 3.3V
PCI, 66 MHz, 3.3V
PCI-X, 133 MHz, 3.3V
GTL (Gunning Transceiver Logic)
GTL Plus
HSTL (High-Speed Transceiver Logic), Class I
HSTL, Class II
HSTL, Class III
HSTL, Class IV
HSTL, Class I, 1.8V
HSTL, Class II, 1.8V
HSTL, Class III, 1.8V
REF
test setup, using values from
, R
REF
, C
R
REF
, and V
Description
MEAS
MEAS
.
fully describe the test
Figure
Table
1.
24.
.) Parameters
www.xilinx.com
PCI33_3 (falling edge)
PCI66_3 (falling edge)
PCI33_3 (rising edge)
PCI66_3 (rising edge)
3. Simulate the output driver of choice into the actual PCB
4. Record the time to V
5. Compare the results of steps 2 and 4. The increase or
X-Ref Target - Figure 1
PCIX (rising edge)
PCIX (falling edge
IOSTANDARD
HSTL_III_18
HSTL_II_18
LVCMOS33
LVCMOS25
LVCMOS18
LVCMOS15
HSTL_I_18
trace and load, using the appropriate IBIS model or
capacitance value to represent the load.
decrease in delay should be added to or subtracted
from the I/O Output Standard Adjustment value
(Table 22, page
propagation delay (clock-to-input) of the PCB trace.
LVTTL (all)
Attribute
HSTL_IV
HSTL_III
HSTL_II
HSTL_I
GTLP
FPGA Output
GTL
Figure 1: Generalized Test Setup
13) to yield the actual worst-case
DC and Switching Characteristics
V
MEAS
REF
R
(Ω)
1M
1M
1M
1M
R
C
(probe capacitance)
1M
25
25
25
25
25
25
25
25
25
50
25
50
25
50
50
REF
.
REF
REF
V
(voltage level at which
delay measurement is taken)
MEAS
C
(pF)
REF
10
10
10
10
10
10
0
0
0
0
0
0
0
0
0
0
0
0
0
0
(2)
(2)
(2)
(2)
(3)
(3)
(1)
ds083-3_06a_092503
V
V
V
V
V
1.65
1.65
1.25
0.75
0.94
2.03
0.94
2.03
0.94
2.03
MEAS
(V)
0.9
0.9
0.8
1.0
0.9
1.1
REF
REF
REF
REF
Module 3 of 4
V
0.75
0.75
(V)
3.3
3.3
3.3
1.2
1.5
1.5
1.5
0.9
0.9
1.8
REF
0
0
0
0
0
0
0
0
17

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