HD6432160 RENESAS [Renesas Technology Corp], HD6432160 Datasheet - Page 493
HD6432160
Manufacturer Part Number
HD6432160
Description
Hitachi 16-Bit Single-Chip Microcomputer
Manufacturer
RENESAS [Renesas Technology Corp]
Datasheet
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Notes on Initialization:
The value of the BBSY bit cannot be modified directly by this module clear function, but since the
stop condition pin waveform is generated according to the state and release timing of the SCL and
SDA pins, the BBSY bit may be cleared as a result. Similarly, state switching of other bits and
flags may also have an effect.
To prevent problems caused by these factors, the following procedure should be used when
initializing the IIC state.
1. Execute initialization of the internal state according to the setting of bits CLR3 to CLR0 or
2. Execute a stop condition issuance instruction (write 0 to BBSY and SCP) to clear the BBSY
3. Re-execute initialization of the internal state according to the setting of bits CLR3 to CLR0 or
4. Initialize (re-set) the IIC registers.
Interrupt flags and interrupt sources are not cleared, and so flag clearing measures must be
taken as necessary.
Basically, other register flags are not cleared either, and so flag clearing measures must be
taken as necessary.
When initialization is executed by DDCSWR, the write data for bits CLR3 to CLR0 is not
retained. To perform IIC clearance, bits CLR3 to CLR0 must be written to simultaneously
using an MOV instruction. Do not use a bit manipulation instruction such as BCLR.
Similarly, when clearing is required again, all the bits must be written to simultaneously in
accordance with the setting.
If a flag clearing setting is made during transmission/reception, the IIC module will stop
transmitting/receiving at that point and the SCL and SDA pins will be released. When
transmission/reception is started again, register initialization, etc., must be carried out as
necessary to enable correct communication as a system.
ICE bit clearing.
bit to 0, and wait for two transfer rate clock cycles.
ICE bit clearing.
Rev. 2.0, 08/02, page 453 of 788
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