MA330013 Microchip Technology, MA330013 Datasheet - Page 22

• Manufacturer Part Number: MA330013
• Description: MODULE PLUG-IN DSPIC33 100TQFP
• Manufacturer: Microchip Technology

Specifications of MA330013

• Accessory Type: Plug-In Module (PIM) - dsPIC33FJ256MC710
• Tool / Board Applications: General Purpose MCU, MPU, DSP, DSC
• Mcu Supported Families: DsPIC33
• Silicon Manufacturer: Microchip
• Core Architecture: DsPIC
• Core Sub-architecture: DsPIC33
• Silicon Core Number: DsPIC33F
• Silicon Family Name: DsPIC33FJxxMCxxx
• Rohs Compliant: Yes
• For Use With: DM330023 - BOARD DEV DSPICDEM MCHV
• Lead Free Status / RoHS Status: Not applicable / Not applicable
• For Use With/related Products: Explorer 16 (DM240001 or DM240002)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Not applicable / Not applicable

dsPIC33F
DS70165E-page 20
Table of Contents
dsPIC33F Product Families ................................................................................................................................................................... 3
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 I/O Ports ................................................................................................................................................................................... 159
11.0 Timer1 ...................................................................................................................................................................................... 161
12.0 Timer2/3, Timer4/5, Timer6/7 and Timer8/9 ............................................................................................................................ 163
13.0 Input Capture............................................................................................................................................................................ 169
14.0 Output Compare....................................................................................................................................................................... 171
15.0 Motor Control PWM Module ..................................................................................................................................................... 175
16.0 Quadrature Encoder Interface (QEI) Module ........................................................................................................................... 197
17.0 Serial Peripheral Interface (SPI)............................................................................................................................................... 205
18.0 Inter-Integrated Circuit (I
19.0 Universal Asynchronous Receiver Transmitter (UART) ........................................................................................................... 223
20.0 Enhanced CAN Module............................................................................................................................................................ 231
21.0 Data Converter Interface (DCI) Module.................................................................................................................................... 261
22.0 10-bit/12-bit Analog-to-Digital Converter (ADC) ....................................................................................................................... 275
23.0 Special Features ...................................................................................................................................................................... 289
24.0 Instruction Set Summary .......................................................................................................................................................... 297
25.0 Development Support............................................................................................................................................................... 305
26.0 Electrical Characteristics .......................................................................................................................................................... 309
27.0 Packaging Information.............................................................................................................................................................. 351
Appendix A: Revision History............................................................................................................................................................. 357
Index ................................................................................................................................................................................................. 359
The Microchip Web Site ..................................................................................................................................................................... 365
Customer Change Notification Service .............................................................................................................................................. 365
Customer Support .............................................................................................................................................................................. 365
Reader Response .............................................................................................................................................................................. 366
Product Identification System ............................................................................................................................................................ 367
Device Overview ........................................................................................................................................................................ 23
CPU............................................................................................................................................................................................ 27
Memory Organization ................................................................................................................................................................. 39
Flash Program Memory.............................................................................................................................................................. 77
Resets ....................................................................................................................................................................................... 83
Interrupt Controller ..................................................................................................................................................................... 87
Direct Memory Access (DMA) .................................................................................................................................................. 135
Oscillator Configuration ............................................................................................................................................................ 149
Power-Saving Features............................................................................................................................................................ 157
2
C) ..................................................................................................................................................... 213
Preliminary
© 2007 Microchip Technology Inc.