MA330013 Microchip Technology, MA330013 Datasheet - Page 311

• Manufacturer Part Number: MA330013
• Description: MODULE PLUG-IN DSPIC33 100TQFP
• Manufacturer: Microchip Technology

Specifications of MA330013

• Accessory Type: Plug-In Module (PIM) - dsPIC33FJ256MC710
• Tool / Board Applications: General Purpose MCU, MPU, DSP, DSC
• Mcu Supported Families: DsPIC33
• Silicon Manufacturer: Microchip
• Core Architecture: DsPIC
• Core Sub-architecture: DsPIC33
• Silicon Core Number: DsPIC33F
• Silicon Family Name: DsPIC33FJxxMCxxx
• Rohs Compliant: Yes
• For Use With: DM330023 - BOARD DEV DSPICDEM MCHV
• Lead Free Status / RoHS Status: Not applicable / Not applicable
• For Use With/related Products: Explorer 16 (DM240001 or DM240002)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Not applicable / Not applicable

26.0
This section provides an overview of dsPIC33F electrical characteristics. Additional information will be provided in future
revisions of this document as it becomes available.
Absolute maximum ratings for the dsPIC33F family are listed below. Exposure to these maximum rating conditions for
extended periods may affect device reliability. Functional operation of the device at these or any other conditions above
the parameters indicated in the operation listings of this specification is not implied.
Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................. .-40°C to +85°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on V
Voltage on any combined analog and digital pin and MCLR, with respect to V
Voltage on any digital-only pin with respect to V
Voltage on V
Maximum current out of V
Maximum current into V
Maximum output current sunk by any I/O pin (Note 3) .............................................................................................4 mA
Maximum output current sourced by any I/O pin (Note 3) ........................................................................................4 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports (Note 2)....................................................................................................200 mA
© 2007 Microchip Technology Inc.
Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
2: Maximum allowable current is a function of device maximum power dissipation (see Table 26-2).
3: Exceptions are CLKOUT, which is able to sink/source 25 mA, and the V
ELECTRICAL CHARACTERISTICS
device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operation listings of this specification is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
and PGDx pins, which are able to sink/source 12 mA.
DD
DDCORE
with respect to V
with respect to V
DD
SS
pin (Note 2)................................................................................................................250 mA
pin ...........................................................................................................................300 mA
SS
(Note 1)
......................................................................................................... -0.3V to +4.0V
SS
................................................................................................ 2.25V to 2.75V
SS
.................................................................................. -0.3V to +5.6V
Preliminary
SS
......................... -0.3V to (V
REF
+, V
REF
dsPIC33F
-, SCLx, SDAx, PGCx
DS70165E-page 309
DD
+ 0.3V)