MA330013 Microchip Technology, MA330013 Datasheet - Page 353

• Manufacturer Part Number: MA330013
• Description: MODULE PLUG-IN DSPIC33 100TQFP
• Manufacturer: Microchip Technology

Specifications of MA330013

• Accessory Type: Plug-In Module (PIM) - dsPIC33FJ256MC710
• Tool / Board Applications: General Purpose MCU, MPU, DSP, DSC
• Mcu Supported Families: DsPIC33
• Silicon Manufacturer: Microchip
• Core Architecture: DsPIC
• Core Sub-architecture: DsPIC33
• Silicon Core Number: DsPIC33F
• Silicon Family Name: DsPIC33FJxxMCxxx
• Rohs Compliant: Yes
• For Use With: DM330023 - BOARD DEV DSPICDEM MCHV
• Lead Free Status / RoHS Status: Not applicable / Not applicable
• For Use With/related Products: Explorer 16 (DM240001 or DM240002)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Not applicable / Not applicable

27.0
27.1
© 2007 Microchip Technology Inc.
PACKAGING INFORMATION
Package Marking Information
64-Lead TQFP (10x10x1 mm)
80-Lead TQFP (12x12x1 mm)
100-Lead TQFP (12x12x1 mm)
100-Lead TQFP (14x14x1mm)
Legend: XX...X
Note:
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
YYWWNNN
YYWWNNN
YYWWNNN
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Y
YY
WW
NNN
*
e
3
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
Preliminary
Example
Example
Example
Example
dsPIC33FJ256
GP710-I/PF
dsPIC33FJ128
dsPIC33FJ256
GP708-I/PT
GP710-I/PT
dsPIC33FJ
256GP706
0710017
0710017
0710017
0710017
-I/PT
dsPIC33F
e
3
e
3
e
)
e
e
3
3
3
DS70165E-page 351