OM11077 NXP Semiconductors, OM11077 Datasheet - Page 6

• Manufacturer Part Number: OM11077
• Description: MODULE DIMM LPC2478 ARM7
• Manufacturer: NXP Semiconductors

Specifications of OM11077

• Accessory Type: Module Card
• For Use With/related Products: ARM-57TS-LPC2478
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-4742

NXP Semiconductors
4. Applications
5. Ordering options
Table 3.
Table 4.
Table 5.
UM10237_4
User manual
Type number
LPC2458FET180 TFBGA180 plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-2
Type number
LPC2458FET180
Type number
LPC2420FBD208 LQFP208
LPC2460FBD208 LQFP208
LPC2460FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 × 15 × 0.7 mm SOT950-1
LPC2458 ordering information
LPC2458 ordering options
LPC2420/60 ordering information
5.1 LPC2458 ordering options
5.2 LPC2460 ordering options
Package
Name
Package
Name
Flash
(kB)
512
•
•
•
•
•
•
Boundary scan for simplified board testing.
Versatile pin function selections allow more possibilities for using on-chip peripheral
functions.
Industrial control
Medical systems
Protocol converter
Communications
64 16 16 2
Description
Description
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
SRAM (kB)
98 16-bit
Rev. 04 — 26 August 2009
External
bus
Ethernet
MII/
RMII
Chapter 1: LPC24XX Introductory information
USB
OTG/
OHC/
DEV
+ 4 kB
FIFO
yes
2
SD/
MMC
yes
GP
DMA
yes
UM10237
© NXP B.V. 2009. All rights reserved.
8
1
Version
Version
SOT459-1
SOT459-1
Temp
range
−40 °C to
+85 °C
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