US38024-BAG1 Renesas Electronics America, US38024-BAG1 Datasheet - Page 667

• Manufacturer Part Number: US38024-BAG1
• Description: DEV EVALUATION KIT H8/38024
• Manufacturer: Renesas Electronics America
• Series: H8®r
• Type: MCUr

Specifications of US38024-BAG1

• Contents: 2G (Second-generation) Evaluation Board, HEW debugger support, Cable and CD-ROM
• For Use With/related Products: H8/38024
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

The form of the bonding pads for the HCD64338024, HCD64338023, HCD64338022,
HCD64338021, HCD64338020, HCD64F38024, HCD64F38024R, HCD64338024S,
HCD64338023S, HCD64338022S, HCD64338021S, and HCD64338020S is shown in figure H.1.
Appendix H Form of Bonding Pads
Figure H.1 Bonding Pad Form
72 mm
Rev. 8.00 Mar. 09, 2010 Page 645 of 658
Appendix H Form of Bonding Pads
5 mm
Bonding area
Metal layer
REJ09B0042-0800