afs600 Actel Corporation, afs600 Datasheet - Page 231

• Manufacturer Part Number: afs600
• Description: Actel Fusion Programmable System Chips Mixed-signal Family With Optional Arm Support
• Manufacturer: Actel Corporation

Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software
refers to the junction temperature, not the ambient,
case, or board temperatures. This is an important
distinction
consumption will cause the chip's junction temperature
to be higher than the ambient, case, or board
temperatures.
relationship between thermal resistance, temperature
gradient, and power.
Table 3-6 •
Product
AFS090-QN108
AFS090-QN180
AFS250-QN180
AFS250-PQ208
AFS600-PQ208
AFS090-FG256
AFS250-FG256
AFS600-FG256
AFS1500-FG256
AFS600-FG484
AFS1500-FG484
AFS1500-FG676
Package Thermal Resistance
because
EQ 3-1
θ
θ
θ
JA
JC
JB
dynamic
through
=
=
=
T
---------------- -
T
--------------- -
T
---------------- -
J
J
J
–
–
–
P
P
P
θ
T
T
B
C
A
Still Air
and
37.7
33.7
28.9
23.3
21.8
21.6
EQ 3-3
TBD
TBD
TBD
TBD
TBD
TBD
static
give
1.0 m/s
power
EQ 3-1
EQ 3-2
EQ 3-3
33.9
30.0
25.2
19.6
18.2
16.8
TBD
TBD
TBD
TBD
TBD
TBD
θ
A d v an c ed v1 . 4
JA
the
where
θ
θ
θ
T
T
T
T
P
JA
JB
JC
J
A
B
C
2.5 m/s
32.2
28.3
23.5
18.0
16.7
15.2
TBD
TBD
TBD
TBD
TBD
TBD
= Junction-to-air thermal resistance
= Junction-to-board thermal resistance
= Junction-to-case thermal resistance
= Junction temperature
= Ambient temperature
= Board temperature (measured 1.0 mm away
= Case temperature
= Total power dissipated by the device
from the package edge)
Actel Fusion Programmable System Chips
11.5
TBD
TBD
TBD
TBD
TBD
TBD
θ
9.3
6.8
4.3
7.7
5.6
JC
29.7
24.8
19.9
14.2
16.8
14.9
TBD
TBD
TBD
TBD
TBD
TBD
θ
JB
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
3-7