afs600 Actel Corporation, afs600 Datasheet - Page 233

• Manufacturer Part Number: afs600
• Description: Actel Fusion Programmable System Chips Mixed-signal Family With Optional Arm Support
• Manufacturer: Actel Corporation

Carefully estimating thermal resistance is important in
the long-term reliability of an Actel FPGA. Design
engineers
consumption of the device with the maximum allowable
power dissipation of the package selected for that device.
Temperature and Voltage Derating Factors
Table 3-7 •
Calculating Power Dissipation
Quiescent Supply Current
Table 3-8 •
Parameter
I
I
I
Notes:
1. –F speed grade devices may experience higher Quiescent Supply current of up to five times the standard I
2. I
3. I
4. I
5. V
Array Voltage
DC1
DC2
DC3
leakage.
page 3-10
OFF, and the voltage regulator is OFF.
regulator are OFF.
shown in
DC1
DC2
DC3
V
CCI
1.425
1.500
1.575
CC
represents the current from the V
represents the current from the V
supply is ON, since the east and west I/O banks are not cold-sparable. Values do not include I/O static contribution, which is
includes V
(V)
Table 3-9 on page 3-10
should
Temperature and Voltage Derating Factors for Timing Delays
(normalized to T
Quiescent Supply Current Characteristics (I
and
Maximum in operating mode (85°C)
Maximum in operating mode (70°C)
Typical in operating mode (25°C)
Typical in standby mode (25°C)
Typical in sleep mode (25°C)
Table 3-10 on page
CC
, V
PUMP
always
–40°C
0.88
0.83
0.80
Conditions and Modes
, and V
J
= 70°C, V
correlate
and
CCI
3-12.
, currents. Values do not include I/O static contribution, which is shown in
Table 3-10 on page
CC33A
CC33A
CC
0.93
0.88
0.85
0°C
= 1.425 V)
4,5
and V
and V
3,5
the
2
CCI
CCI
2
2
power
supplies when the RTC (and the crystal oscillator), the FPGA, and the voltage
supplies when the RTC (and the 32 kHz crystal oscillator) is ON, the FPGA is
A d v an c ed v1 . 4
DDQ
Junction Temperature (°C)
3-12.
25°C
0.95
0.90
0.87
)
1
AFS1500
Note: The junction-to-air and junction-to-board thermal
resistances are based on JEDEC standard (JESD-51) and
assumptions made in building the model. It may not be
realized in actual application and therefore should be
used with a degree of caution. Junction-to-case thermal
resistance assumes that all power is dissipated through
the case.
TBD
TBD
TBD
TBD
TBD
70°C
1.00
0.95
0.91
AFS600
45 mA
200 µA
30 mA
Actel Fusion Programmable System Chips
10 µA
5 mA
85°C
1.02
0.96
0.93
AFS250
30 mA
20 mA
200 µA
3 mA
10 µA
DD
, and higher I/O
Table 3-9 on
AFS090
110°C
15 mA
10 mA
200 µA
1.05
0.99
0.96
10 µA
2 mA
3-9