ST72F324BJ6B6 STMicroelectronics, ST72F324BJ6B6 Datasheet - Page 189

• Manufacturer Part Number: ST72F324BJ6B6
• Description: MCU 8BIT 32KB FLASH/ROM 42-SDIP
• Manufacturer: STMicroelectronics
• Series: ST7r

Specifications of ST72F324BJ6B6

• Core Processor: ST7
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 32
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 3.8 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 42-SDIP (0.600", 15.24mm)
• Controller Family/series: ST7
• No. Of I/o's: 32
• Ram Memory Size: 1KB
• Cpu Speed: 8MHz
• No. Of Timers: 2
• Embedded Interface Type: SCI, SPI
• No. Of Pwm Channels: 3
• Processor Series: ST72F3x
• Core: ST7
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Development Tools By Supplier: ST7232X-EVAL, ST7MDT20-DVP3, ST7MDT20J-EMU3, STX-RLINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 12 Channel
• For Use With: 497-6421 - BOARD EVAL DGTL BATT CHGR DESIGN497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-5589-5

ST72324Bxx
15.2
15.2.1
15.2.2
15.3
15.3.1
15.3.2
In the same way, as long as the SBK bit is set, break characters are sent to the TDO pin.
This may lead to generate one break more than expected.
Occurrence
The occurrence of the problem is random and proportional to the baud rate. With a transmit
frequency of 19200 baud (f
occurrence is around 1%.
Workaround
If this wrong duration is not compliant with the communication protocol in the application,
software can request that an Idle line be generated before the break character. In this case,
the break duration is always correct assuming the application is not doing anything between
the idle and the break. This can be ensured by temporarily disabling interrupts.
The exact sequence is:
1.
2.
3.
4.
8/16 Kbyte Flash devices only
39-pulse ICC entry mode
ICC mode entry using ST7 application clock (39 pulses) is not supported. External clock
mode must be used (36 pulses). Refer to the ST7 Flash Programming Reference Manual.
Negative current injection on pin PB0
Negative current injection on pin PB0 degrades the performance of the device and is not
allowed on this pin.
8/16 Kbyte ROM devices only
Readout protection with LVD
Readout protection is not supported if the LVD is enabled.
I/O Port A and F configuration
When using an external quartz crystal or ceramic resonator, a few f
be lost when the signal pattern in
device to enter test mode and return to user mode after a few clock periods. User program
execution and I/O status are not changed, only a few clock cycles are lost.
This happens with either one of the following configurations
●
●
This is detailed in
Disable interrupts
Reset and set TE (IDLE request)
Set and reset SBK (break request)
Re-enable interrupts
PA3 = 0, PF4 = 1, PF1 = 0 while PLL option is disabled and PF0 is toggling
PA3 = 0, PF4 = 1, PF1 = 0, PF0 = 1 while PLL option is enabled
Table
125.
CPU
= 8MHz and SCIBRR = 0xC9), the wrong break duration
Table 125
occurs. This is because this pattern causes the
OSC2
Known limitations
clock periods may
189/193