ST72F324BJ6B6 STMicroelectronics, ST72F324BJ6B6 Datasheet - Page 192

• Manufacturer Part Number: ST72F324BJ6B6
• Description: MCU 8BIT 32KB FLASH/ROM 42-SDIP
• Manufacturer: STMicroelectronics
• Series: ST7r

Specifications of ST72F324BJ6B6

• Core Processor: ST7
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 32
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 3.8 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 42-SDIP (0.600", 15.24mm)
• Controller Family/series: ST7
• No. Of I/o's: 32
• Ram Memory Size: 1KB
• Cpu Speed: 8MHz
• No. Of Timers: 2
• Embedded Interface Type: SCI, SPI
• No. Of Pwm Channels: 3
• Processor Series: ST72F3x
• Core: ST7
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Development Tools By Supplier: ST7232X-EVAL, ST7MDT20-DVP3, ST7MDT20J-EMU3, STX-RLINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 12 Channel
• For Use With: 497-6421 - BOARD EVAL DGTL BATT CHGR DESIGN497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-5589-5

Revision history
192/193
Table 126. Document revision history (continued)
17-Mar-2009
10-Oct-2007
Date
Revision
6
7
Removed references to automotive versions (these are covered by
separate ST72324B-Auto datasheet).
Changed Flash endurance to 1 Kcycles at 55°C
Replaced TQFP with LQFP in package outline and device summary on
page
Figure 1 on page
memory block
Replaced TQFP with LQFP in
page 16
Changed note 3 in
Changed
Changed
Added unit of measure to LVD supply current in
148
Replaced TQFP with LQFP in
Changed note 4 in
Changed
Removed EMC protective circuitry in
works correctly without these components)
Changed titles of
Replaced TQFP with LQFP in
Changed
Replaced TQFP with LQFP in
page
page 184
Removed soldering information section.
In
the conversion” paragraph: added “ or a write to any bit of the ADCCSR
register”.
Modified t
page 154
Section 13.2: Package mechanical data on page 172
inches rounded to 4 decimal digits).
Modified
on page 157
Added
Modified
Section 10.6.3: Functional description on page
181, in
1
Section 13.1: ECOPACK on page
and in
Section 12.8.3: Absolute maximum ratings (electrical sensitivity)
“Device configuration and ordering information” on page
Section 10.1.3 on page 65
Master mode operation on page 99
Figure 78 on page 163
Section 13.6 on page 171
RET
.
Section Table 122. on page 182
(removed DLU and V
values in
Table 2 on page 17
Figure 89 on page 172
14: Replaced 60 Kbytes with 32 Kbytes in program
Section 9.2.1 on page 58
Section 12.9.1 on page 158
Table 101: Dual voltage HDFlash memory on
Section 14.1 on page
Figure 2 on page
Section 12.8.2 on page 156
Section 13.3 on page 177
Changes
ESD (MM)
Figure 79 on page 164
and
172.
).
Figure 91 on page 174
and in
Section 12.5.3 on page
15, in
129, modified “Starting
Section 14.3.5 on
179, in
modified (values in
Figure 4 on
ST72324Bxx
Table 122 on
(device
178.