MC9S12E128CFU Freescale Semiconductor, MC9S12E128CFU Datasheet - Page 568

IC MCU 128K FLASH 25MHZ 80-QFP

MC9S12E128CFU

Manufacturer Part Number
MC9S12E128CFU
Description
IC MCU 128K FLASH 25MHZ 80-QFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheets

Specifications of MC9S12E128CFU

Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
EBI/EMI, I²C, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
60
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 2.75 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-QFP
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
SCI, SPI
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
60
Number Of Timers
16 bit
Operating Supply Voltage
3.135 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
On-chip Dac
8 bit, 2 Channel
For Use With
M68EVB912E128 - BOARD EVAL FOR MC9S12E128/64
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Lead Free Status / Rohs Status
No RoHS Version Available

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Appendix A Electrical Characteristics
Two cases with internal voltage regulator enabled and disabled must be considered:
1
2
3
568
Num
The values for thermal resistance are achieved by package simulations
PC Board according to EIA/JEDEC Standard 51-3
PC Board according to EIA/JEDEC Standard 51-7
10
1
2
3
4
5
6
7
8
9
1. Internal Voltage Regulator disabled
2. Internal voltage regulator enabled
Which is the sum of all output currents on I/O ports associated with VDDX and VDDM.
For R
respectively
I
additionally contains the current flowing into the external loads with output high.
Which is the sum of all output currents on I/O ports associated with VDDX and VDDR.
DDR
R
R
P
P
C
T
T
T
T
T
T
T
T
T
T
P
P
IO
DSON
DSON
INT
INT
IO
is the current shown in
DSON
=
Thermal Resistance LQFP112, single sided PCB
Thermal Resistance LQFP112, double sided PCB
Junction to Board LQFP112
Junction to Case LQFP112
Junction to Package Top LQFP112
Thermal Resistance QFP 80, single sided PCB
Thermal Resistance QFP 80, double sided PCB
Junction to Board QFP80
Junction to Case QFP80
Junction to Package Top QFP80
=
=
=
with 2 internal planes
with 2 internal planes
I
I
i
i
=
=
DDR
is valid:
DD
R
R
V
----------- - for outputs driven low
V
----------------------------------- - for outputs driven high
I
OL
DSON
DSON
OL
DD5
V
V
DD
I
;
OH
DDR
+
V
I
Table A-5. Thermal Package Characteristics
I
OH
I
IO i
IO i
DDPLL
+
I
Rating
2
;
2
DDA
3
Table A-8
MC9S12E128 Data Sheet, Rev. 1.07
V
V
DDPLL
DDA
and not the overall current flowing into VDDR, which
+
I
DDA
2
V
DDA
Symbol
JC
JC
JA
JA
JB
JA
JA
JB
JT
JT
Min
1
Typ
Freescale Semiconductor
Max
54
41
31
11
51
41
27
14
2
3
o
o
o
o
o
o
o
o
o
o
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W

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