MC9S12E128CFU Freescale Semiconductor, MC9S12E128CFU Datasheet - Page 600

• Manufacturer Part Number: MC9S12E128CFU
• Description: IC MCU 128K FLASH 25MHZ 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12E128CFU

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 60
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 2.75 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-QFP
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 60
• Number Of Timers: 16 bit
• Operating Supply Voltage: 3.135 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• On-chip Dac: 8 bit, 2 Channel
• For Use With: M68EVB912E128 - BOARD EVAL FOR MC9S12E128/64
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No RoHS Version Available

Appendix B Package Information
B.2
600
DATUM
PLANE
L
SEATING
PLANE
-A-
-C-
-H-
80-Pin QFP Package
C
61
80
60
E
DETAIL C
1
H
Figure B-2. 80-Pin QFP Mechanical Dimensions (Case no. 841B)
0.20
0.05 A-B
0.20
G
W
M
M
X
H
C
A
S
K
L
A-B
A-B
DETAIL A
U
R
-D-
T
MC9S12E128 Data Sheet, Rev. 1.07
S
S
D
D
Q
S
S
20
M
M
41
NOTES:
40
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF
4. DATUMS -A-, -B- AND -D- TO BE
5. DIMENSIONS S AND V TO BE DETERMINED
6. DIMENSIONS A AND B DO NOT INCLUDE
7. DIMENSION D DOES NOT INCLUDE DAMBAR
21
ANSI Y14.5M, 1982.
LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING LINE.
DETERMINED AT DATUM PLANE -H-.
AT SEATING PLANE -C-.
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
A AND B DO INCLUDE MOLD MISMATCH
AND ARE DETERMINED AT DATUM PLANE -H-.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR CANNOT
BE LOCATED ON THE LOWER RADIUS OR
THE FOOT.
-B-
B
DETAIL C
-H-
0.10
V
DATUM
PLANE
J
0.20
SECTION B-B
VIEW ROTATED 90
DETAIL A
Freescale Semiconductor
B
B
M
C
F
D
A-B
DIM
W
A
B
C
D
E
G
H
K
M
N
P
Q
R
S
U
V
X
F
J
L
T
S
-A-,-B-,-D-
13.90
13.90
16.95
16.95
MILLIMETERS
MIN
2.15
0.22
2.00
0.22
0.13
0.65
0.13
0.13
0.13
0.35
12.35 REF
0.325 BSC
N
0.65 BSC
---
D
5
0
0
1.6 REF
P
S
14.10
14.10
17.45
17.45
MAX
2.45
0.38
2.40
0.33
0.25
0.23
0.95
0.17
0.30
0.45
10
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