HD64F2378RVFQ33 Renesas Electronics America, HD64F2378RVFQ33 Datasheet - Page 1021

IC H8S MCU FLASH 512K 144-LQFP

HD64F2378RVFQ33

Manufacturer Part Number
HD64F2378RVFQ33
Description
IC H8S MCU FLASH 512K 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of HD64F2378RVFQ33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
The H8S/2375 and H8S/2375R have 256 kbytes of masked ROM. The on-chip ROM is connected
to the CPU, data transfer controller (DTC), and DMA controller (DMAC) with a 16-bit data bus.
The on-chip ROM can be accessed by the CPU, DTC, and DMAC in 8 or 16-bit units. The data in
the on-chip ROM can always be accessed in one state.
The on-chip ROM is enabled or disabled according to the operating mode. The operating mode is
selected by the mode setting pins MD2 to MD0 as shown in table 3.1. Select mode 4 or 7 when the
on-chip ROM is used, and mode 1 or 2 when the on-chip ROM is not used. The on-chip ROM is
allocated in area 0.
Figure 22.1 Block Diagram of 256-kbyte Masked ROM (HD6432375)
Section 22 Masked ROM
H'000000
H'000002
H'03FFFE
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'000001
H'000003
H'03FFFF
Rev.7.00 Mar. 18, 2009 page 953 of 1136
Section 22 Masked ROM
REJ09B0109-0700

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