HD64F2378RVFQ33 Renesas Electronics America, HD64F2378RVFQ33 Datasheet - Page 255

IC H8S MCU FLASH 512K 144-LQFP

HD64F2378RVFQ33

Manufacturer Part Number
HD64F2378RVFQ33
Description
IC H8S MCU FLASH 512K 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of HD64F2378RVFQ33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Section 6 Bus Controller (BSC)
6.5.4
Wait Control
When accessing external space, this LSI can extend the bus cycle by inserting one or more wait
states (T
). There are two ways of inserting wait states: program wait insertion and pin wait
w
insertion using the WAIT pin.
Program Wait Insertion: From 0 to 7 wait states can be inserted automatically between the T
2
state and T
state on an individual area basis in 3-state access space, according to the settings in
3
WTCRA and WTCRB.
Pin Wait Insertion: Setting the WAITE bit to 1 in BCR enables wait input by means of the
WAIT pin. When external space is accessed in this state, a program wait is first inserted in
accordance with the settings in WTCRA and WTCRB. If the WAIT pin is low at the falling edge
state is inserted. If the WAIT pin is held low, T
of φ in the last T
or T
state, another T
states
2
w
w
w
are inserted until it goes high. This is useful when inserting seven or more T
states, or when
w
changing the number of T
states to be inserted for different external devices. The WAITE bit
w
setting applies to all areas. Figure 6.18 shows an example of wait state insertion timing.
The settings after a reset are: 3-state access, insertion of 7 program wait states, and WAIT input
disabled.
Rev.7.00 Mar. 18, 2009 page 187 of 1136
REJ09B0109-0700

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