HD64F2378RVFQ33 Renesas Electronics America, HD64F2378RVFQ33 Datasheet - Page 256

IC H8S MCU FLASH 512K 144-LQFP

HD64F2378RVFQ33

Manufacturer Part Number
HD64F2378RVFQ33
Description
IC H8S MCU FLASH 512K 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of HD64F2378RVFQ33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Section 6 Bus Controller (BSC)
6.5.5
The read strobe (RD) timing can be changed for individual areas by setting bits RDN7 to RDN0 to
1 in RDNCR. Figure 6.19 shows an example of the timing when the read strobe timing is changed
in basic bus 3-state access space.
When the DMAC or EXDMAC is used in single address mode, note that if the RD timing is
changed by setting RDNn to 1, the RD timing will change relative to the rise of DACK or
EDACK.
Rev.7.00 Mar. 18, 2009 page 188 of 1136
REJ09B0109-0700
Read
Write
Notes: 1. Downward arrows indicate the timing of WAIT pin sampling.
Read Strobe (RD) Timing
2. When RDN = 0
φ
WAIT
Address bus
AS
RD
Data bus
HWR, LWR
Data bus
Figure 6.18 Example of Wait State Insertion Timing
T
1
By program wait
T
2
T
w
Write data
T
By WAIT pin
w
T
w
Read data
T
3

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