HD64F2378RVFQ33 Renesas Electronics America, HD64F2378RVFQ33 Datasheet - Page 65

• Manufacturer Part Number: HD64F2378RVFQ33
• Description: IC H8S MCU FLASH 512K 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of HD64F2378RVFQ33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 97
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 6x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 16 I
Table 16.1
Table 16.2
Table 16.3
Table 16.4
Section 17 A/D Converter..................................................................................805
Table 17.1
Table 17.2
Table 17.3
Table 17.4
Table 17.5
Table 17.6
Section 18 D/A Converter..................................................................................821
Table 18.1
Table 18.2
Table 18.3
Table 18.4
Section 19 RAM ................................................................................................831
Section 20 Flash Memory (0.35-μm F-ZTAT Version) ....................................833
Table 20.1
Table 20.2
Table 20.3
Table 20.4
Table 20.5
Table 20.6
Table 20.7
Section 21 Flash Memory (0.18-μm F-ZTAT Version) ....................................861
Table 21.1
Table 21.2
Table 21.3
Table 21.4
Table 21.5
Table 21.6
Table 21.7
Table 21.8 (1) Useable Area for Programming in User Program Mode ....................................... 912
Pin Configuration .................................................................................................... 773
Transfer Rate ........................................................................................................... 776
Interrupt Requests ................................................................................................... 801
Time for monitoring SCL........................................................................................ 802
Pin Configuration .................................................................................................... 807
Analog Input Channels and Corresponding ADDR Registers................................. 808
A/D Conversion Time (Single Mode) ..................................................................... 814
A/D Conversion Time (Scan Mode)........................................................................ 815
A/D Converter Interrupt Source .............................................................................. 816
Analog Pin Specifications ....................................................................................... 820
Pin Configuration .................................................................................................... 824
Control of D/A Conversion ..................................................................................... 826
Control of D/A Conversion ..................................................................................... 827
Control of D/A Conversion ..................................................................................... 828
Differences between Boot Mode and User Program Mode..................................... 835
Pin Configuration .................................................................................................... 840
Erase Blocks............................................................................................................ 845
Setting On-Board Programming Mode ................................................................... 846
Boot Mode Operation.............................................................................................. 848
System Clock Frequencies for which Automatic Adjustment
of LSI Bit Rate Is Possible ...................................................................................... 849
Flash Memory Operating States .............................................................................. 855
Comparison of Programming Modes ...................................................................... 865
Pin Configuration .................................................................................................... 870
Register/Parameter and Target Mode...................................................................... 872
Parameters and Target Modes ................................................................................. 880
Setting On-Board Programming Mode ................................................................... 891
System Clock Frequency for Automatic-Bit-Rate Adjustment by This LSI ........... 893
Executable MAT ..................................................................................................... 911
2
C Bus Interface 2 (IIC2) (Option) .................................................771
Rev.7.00 Mar. 18, 2009 page lxiii of lxvi
REJ09B0109-0700