HD64F2378RVFQ33 Renesas Electronics America, HD64F2378RVFQ33 Datasheet - Page 939

IC H8S MCU FLASH 512K 144-LQFP

HD64F2378RVFQ33

Manufacturer Part Number
HD64F2378RVFQ33
Description
IC H8S MCU FLASH 512K 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of HD64F2378RVFQ33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Section 21 Flash Memory (0.18-μm F-ZTAT Version)
21.3
Register Descriptions
The registers/parameters which control flash memory are shown as follows.
• Flash code control status register (FCCS)
• Flash program code select register (FPCS)
• Flash erase code select register (FECS)
• Flash key code register (FKEY)
• Flash MAT select register (FMATS)
• Flash transfer destination address register (FTDAR)
• Download pass and fail result (DPFP)
• Flash pass and fail result (FPFR)
• Flash multipurpose address area (FMPAR)
• Flash multipurpose data destination area (FMPDR)
• Flash erase Block select (FEBS)
• Flash program and erase frequency control (FPEFEQ)
• Flash vector address control register (FVACR)
There are several operating modes for accessing flash memory, for example, read mode/program
mode.
There are two memory MATs: user MAT and user boot MAT. The dedicated registers/parameters
are allocated for each operating mode and MAT selection. The correspondence of operating modes
and registers/parameters for use is shown in table 21.3.
Rev.7.00 Mar. 18, 2009 page 871 of 1136
REJ09B0109-0700

Related parts for HD64F2378RVFQ33