HD64F2378RVFQ33 Renesas Electronics America, HD64F2378RVFQ33 Datasheet - Page 257

IC H8S MCU FLASH 512K 144-LQFP

HD64F2378RVFQ33

Manufacturer Part Number
HD64F2378RVFQ33
Description
IC H8S MCU FLASH 512K 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of HD64F2378RVFQ33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
6.5.6
Some external I/O devices require a setup time and hold time between address and CS signals and
strobe signals such as RD, HWR, and LWR. Settings can be made in the CSACR register to insert
states in which only the CS, AS, and address signals are asserted before and after a basic bus space
access cycle. Extension of the CS assertion period can be set for individual areas. With the CS
assertion extension period in write access, the data setup and hold times are less stringent since the
write data is output to the data bus.
RDNn = 0
RDNn = 1
Extension of Chip Select (CS) Assertion Period
φ
Address bus
CSn
AS
RD
Data bus
RD
Data bus
DACK,
EDACK
Figure 6.19 Example of Read Strobe Timing
T
1
Rev.7.00 Mar. 18, 2009 page 189 of 1136
Bus cycle
T
2
Section 6 Bus Controller (BSC)
REJ09B0109-0700
T
3

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