HD64F2378RVFQ33 Renesas Electronics America, HD64F2378RVFQ33 Datasheet - Page 1184

IC H8S MCU FLASH 512K 144-LQFP

HD64F2378RVFQ33

Manufacturer Part Number
HD64F2378RVFQ33
Description
IC H8S MCU FLASH 512K 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of HD64F2378RVFQ33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Appendix
BSET
#xx:3,@aa:8
BSET
#xx:3,@aa:16
BSET
#xx:3,@aa:32
BSET Rn,Rd
BSET Rn,@ERd R:W 2nd R:B:M EA R:W:M
BSET Rn,@aa:8 R:W 2nd R:B:M EA R:W:M
BSET
Rn,@aa:16
BSET
Rn,@aa:32
BSR
d:8
BSR
d:16
BST #xx:3,Rd
BST
#xx:3,@ERd
BST
#xx:3,@aa:8
BST
#xx:3,@aa:16
BST
#xx:3,@aa:32
BTST #xx:3,Rd R:W
BTST
#xx:3,@ERd
BTST
#xx:3,@aa:8
BTST
#xx:3,@aa:16
Rev.7.00 Mar. 18, 2009 page 1116 of 1136
REJ09B0109-0700
Instruction
Advanced R:W
Advanced R:W 2nd 1 State of
R:W 2nd R:B:M EA R:W:M
R:W 2nd R:W 3rd
R:W 2nd R:W 3rd
R:W
NEXT
R:W 2nd R:W 3rd
R:W 2nd R:W 3rd
NEXT
R:W
NEXT
R:W 2nd R:B:M EA R:W:M
R:W 2nd R:B:M EA R:W:M
R:W 2nd R:W 3rd
R:W 2nd R:W 3rd
NEXT
R:W 2nd R:B EA
R:W 2nd R:B EA
R:W 2nd R:W 3rd
1
R:W EA
internal
operation
2
NEXT
R:B:M EA R:W:M
R:W 4th
NEXT
NEXT
R:B:M EA R:W:M
R:W 4th
W:W:M
Stack (H)
R:W EA
NEXT
NEXT
R:B:M EA R:W:M
R:W 4th
R:W
NEXT
R:W
NEXT
R:B EA
3
W:B EA
NEXT
R:B:M EA R:W:M
W:B EA
W:B EA
NEXT
R:B:M EA R:W:M
W:W
Stack (L)
W:W:M
Stack (H)
W:B EA
W:B EA
NEXT
R:B:M EA R:W:M
R:W
NEXT
4
W:B EA
NEXT
W:B EA
NEXT
W:W
Stack (L)
W:B EA
NEXT
5
W:B EA
W:B EA
W:B EA
6
7
8
9

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