HD64F2378RVFQ33 Renesas Electronics America, HD64F2378RVFQ33 Datasheet - Page 292

IC H8S MCU FLASH 512K 144-LQFP

HD64F2378RVFQ33

Manufacturer Part Number
HD64F2378RVFQ33
Description
IC H8S MCU FLASH 512K 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of HD64F2378RVFQ33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Section 6 Bus Controller (BSC)
6.7.8
When the command interval specification from the ACTV command to the next READ/WRIT
command cannot be satisfied, 1 to 3 states (Trw) that output the NOP command can be inserted
between the Tr cycle that outputs the ACTV command and the Tc1 cycle that outputs the column
address by setting the RCD1 and RCD0 bits of DRACCR. Use the optimum setting for the wait
time according to the synchronous DRAM connected and the operating frequency of this LSI.
Figure 6.46 shows an example of the timing when the one Trw state is set.
Rev.7.00 Mar. 18, 2009 page 224 of 1136
REJ09B0109-0700
Figure 6.46 Example of Access Timing when Row Address Output Hold State Is 1 State
Row Address Output State Control
Read
Write
Address bus
DQMU, DQML
DQMU, DQML
Precharge-sel
Data bus
Data bus
SDRAMφ
(RCD1 = 0, RCD0 = 1, SDWCD = 0, CAS Latency 2)
CKE
CKE
RAS
RAS
CAS
CAS
WE
WE
φ
Column
address
PALL
PALL
T
p
ACTV
ACTV
T
r
Row address
Row address
NOP
High
High
T
rw
NOP
READ
T
c1
Column address
WRIT
T
cl
NOP
NOP
T
c2

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