HD64F2378RVFQ33 Renesas Electronics America, HD64F2378RVFQ33 Datasheet - Page 43

• Manufacturer Part Number: HD64F2378RVFQ33
• Description: IC H8S MCU FLASH 512K 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of HD64F2378RVFQ33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 97
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 6x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

26.3 Electrical Characteristics for H8S/2374, H8S/2372, H8S/2371, H8S/2370,
26.4 Timing Charts .................................................................................................................. 1067
Appendix
A.
B.
C.
D.
Index
26.2.3 AC Characteristics .............................................................................................. 1039
26.2.4 A/D Conversion Characteristics.......................................................................... 1048
26.2.5 D/A Conversion Characteristics.......................................................................... 1048
26.2.6 Flash Memory Characteristics ............................................................................ 1049
H8S/2378R, H8S/2374R, H8S/2372R, H8S/2371R, H8S/2370R.................................... 1050
26.3.1 Absolute Maximum Ratings ............................................................................... 1050
26.3.2 DC Characteristics .............................................................................................. 1051
26.3.3 AC Characteristics .............................................................................................. 1054
26.3.4 A/D Conversion Characteristics.......................................................................... 1063
26.3.5 D/A Conversion Characteristics.......................................................................... 1063
26.3.6 Flash Memory Characteristics ............................................................................ 1064
26.4.1 Clock Timing ...................................................................................................... 1067
26.4.2 Control Signal Timing ........................................................................................ 1069
26.4.3 Bus Timing ......................................................................................................... 1070
26.4.4 DMAC and EXDMAC Timing........................................................................... 1088
26.4.5 Timing of On-Chip Peripheral Modules ............................................................. 1091
I/O Port States in Each Pin State...................................................................................... 1095
Product Lineup................................................................................................................. 1105
Package Dimensions ........................................................................................................ 1106
Bus State during Execution of Instructions...................................................................... 1108
........................................................................................................1095
........................................................................................................1131
Rev.7.00 Mar. 18, 2009 page xli of lxvi
REJ09B0109-0700