HD64F2378RVFQ33 Renesas Electronics America, HD64F2378RVFQ33 Datasheet - Page 925

• Manufacturer Part Number: HD64F2378RVFQ33
• Description: IC H8S MCU FLASH 512K 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of HD64F2378RVFQ33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 97
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 6x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

6. Do not perform additional programming. Erase the memory before reprogramming.
7. Before programming, check that the chip is correctly mounted in the PROM programmer.
8. Do not touch the socket adapter or chip during programming.
9. Apply the reset signal after the SWE, bit is cleared during its operation.
In on-board programming, perform only one programming operation on a 128-byte
programming unit block. In programmer mode, too, perform only one programming operation
on a 128-byte programming unit block. Programming should be carried out with the entire
programming unit block erased.
Overcurrent damage to the device can result if the index marks on the PROM programmer
socket, socket adapter, and chip are not correctly aligned.
Touching either of these can cause contact faults and write errors.
The reset signal is applied at least 100 µs after the SWE bit has been cleared.
Section 20 Flash Memory (0.35-μm F-ZTAT Version)
Rev.7.00 Mar. 18, 2009 page 857 of 1136
REJ09B0109-0700