HD64F2378RVFQ33 Renesas Electronics America, HD64F2378RVFQ33 Datasheet - Page 1102
HD64F2378RVFQ33
Manufacturer Part Number
HD64F2378RVFQ33
Description
IC H8S MCU FLASH 512K 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of HD64F2378RVFQ33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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Section 26 Electrical Characteristics
Notes: 1. Follow the program/erase algorithms when making the time settings.
26.1.7
The F-ZTAT and masked ROM versions both satisfy the electrical characteristics shown in this
manual, but actual electrical characteristic values, operating margins, noise margins, and other
properties may vary due to differences in manufacturing process, on-chip ROM, layout patterns,
and so on.
When system evaluation testing is carried out using the F-ZTAT version, the same evaluation
testing should also be conducted for the masked ROM version when changing over to that version.
Rev.7.00 Mar. 18, 2009 page 1034 of 1136
REJ09B0109-0700
2. Programming time per 128 bytes. (Indicates the total time during which the P bit is set
3. Time to erase one block. (Indicates the time during which the E bit is set in FLMCR1.
4. Maximum programming time
5. The maximum number of programming (N) should be set as shown below according to
6. For the maximum erase time (t
7. The minimum number of rewrites after which all characteristics are guaranteed.
8. Reference value for 25°C. (Rewrites usually function up to this standard value.)
9. The data retention characteristics within the specification range, including the minimum
Usage Note
(Additional programming)
Number of programming (n)
in flash memory control register 1 (FLMCR1). Does not include the program-verify
time.)
Does not include the erase-verify time.)
the actual set value of (z) so as not to exceed the maximum programming time
(t
The wait time after P bit setting (z) should be changed as follows according to the
number of programming (n).
Number of programming (n)
wait time after E bit setting (z) and the maximum number of erases (N):
(Characteristics are guaranteed over a range of one rewrite to the minimum number of
rewrites.)
number of rewrites.
P
(max)).
t
1 ≤ n ≤ 6
7 ≤ n ≤ 1000
1 ≤ n ≤ 6
t
P
E
(max) = Wait time after E bit setting (z) × maximum number of erases (N)
(max) = Σ wait time after P bit setting (z)
i=1
N
z = 30 µs
z = 200 µs
z = 10 µs
E
(max)), the following relationship applies between the
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