HD64F2378RVFQ33 Renesas Electronics America, HD64F2378RVFQ33 Datasheet - Page 290

IC H8S MCU FLASH 512K 144-LQFP

HD64F2378RVFQ33

Manufacturer Part Number
HD64F2378RVFQ33
Description
IC H8S MCU FLASH 512K 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of HD64F2378RVFQ33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Section 6 Bus Controller (BSC)
6.7.7
CAS latency is controlled by settings of the W22 to W20 bits of WTCRB. Set the CAS latency
count, as shown in table 6.10, by the setting of synchronous DRAM. Depending on the setting, the
CAS latency control cycle (T
AST2 bit of ASTCR. Figure 6.45 shows the CAS latency control timing when synchronous
DRAM of CAS latency 3 is connected.
The initial value of W22 to W20 is H'7. Set the register according to the CAS latency of
synchronous DRAM to be connected.
Table 6.10 Setting CAS Latency
W22
0
1
Rev.7.00 Mar. 18, 2009 page 222 of 1136
REJ09B0109-0700
CAS Latency Control
W21
0
1
0
1
W20
0
1
0
1
0
1
0
1
c1
Description
Connect synchronous DRAM of CAS
latency 1
Connect synchronous DRAM of CAS
latency 2
Connect synchronous DRAM of CAS
latency 3
Connect synchronous DRAM of CAS
latency 4
Reserved (must not used)
Reserved (must not used)
Reserved (must not used)
Reserved (must not used)
) is inserted. WTCRB can be set regardless of the setting of the
CAS Latency Control
Cycle Inserted
0 state
1 state
2 states
3 states

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