SI1000-C-GM Silicon Laboratories Inc, SI1000-C-GM Datasheet - Page 144
SI1000-C-GM
Manufacturer Part Number
SI1000-C-GM
Description
IC TXRX MCU + EZRADIOPRO
Manufacturer
Silicon Laboratories Inc
Specifications of SI1000-C-GM
Package / Case
42-QFN
Frequency
240MHz ~ 960MHz
Data Rate - Maximum
256kbps
Modulation Or Protocol
FSK, GFSK, OOK
Applications
General Purpose
Power - Output
20dBm
Sensitivity
-121dBm
Voltage - Supply
1.8 V ~ 3.6 V
Current - Receiving
18.5mA
Current - Transmitting
85mA
Data Interface
PCB, Surface Mount
Memory Size
64kB Flash, 4kB RAM
Antenna Connector
PCB, Surface Mount
Number Of Receivers
1
Number Of Transmitters
1
Wireless Frequency
240 MHz to 960 MHz
Interface Type
UART, SMBus, SPI, PCA
Output Power
20 dBm
Operating Supply Voltage
0.9 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Maximum Supply Current
4.1 mA
Minimum Operating Temperature
- 40 C
Modulation
FSK, GFSK, OOK
Protocol Supported
C2, SMBus
Core
8051
Program Memory Type
Flash
Program Memory Size
64 KB
Data Ram Size
4352 B
Supply Current (max)
4.1 mA
Cpu Family
Si100x
Device Core
8051
Device Core Size
8b
Frequency (max)
25MHz
Total Internal Ram Size
4.25KB
# I/os (max)
22
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8V
On-chip Adc
18-chx10-bit
Instruction Set Architecture
CISC
Mounting
Surface Mount
Pin Count
42
Package Type
QFN EP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Operating Temperature
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1881-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SI1000-C-GM
Manufacturer:
FSC
Quantity:
1 000
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Si1000/1/2/3/4/5
The level of Flash security depends on the Flash access method. The three Flash access methods that
can be restricted are reads, writes, and erases from the C2 debug interface, user firmware executing on
unlocked pages, and user firmware executing on locked pages. Table 13.1 summarizes the Flash security
features of the Si1000/1/2/3/4/5 devices.
144
Read, Write or Erase unlocked pages
(except page with Lock Byte)
Read, Write or Erase locked pages
(except page with Lock Byte)
Read or Write page containing Lock Byte
(if no pages are locked)
Read or Write page containing Lock Byte
(if any page is locked)
Read contents of Lock Byte
(if no pages are locked)
Read contents of Lock Byte
(if any page is locked)
Erase page containing Lock Byte
(if no pages are locked)
Erase page containing Lock Byte - Unlock all pages
(if any page is locked)
Lock additional pages
(change 1s to 0s in the Lock Byte)
Unlock individual pages
(change 0s to 1s in the Lock Byte)
Read, Write or Erase Reserved Area
C2DE—C2 Device Erase (Erases all Flash pages including the page containing the Lock Byte)
FEDR—Not permitted; Causes Flash Error Device Reset (FERROR bit in RSTSRC is 1 after reset)
- All prohibited operations that are performed via the C2 interface are ignored (do not cause device reset).
- Locking any Flash page also locks the page containing the Lock Byte.
- Once written to, the Lock Byte cannot be modified except by performing a C2 Device Erase.
- If user code writes to the Lock Byte, the Lock does not take effect until the next device reset.
- The scratchpad is locked when all other Flash pages are locked.
- The scratchpad is erased when a Flash Device Erase command is performed.
Action
Table 13.1. Flash Security Summary
Rev. 1.0
Permitted
Not Permitted FEDR
Permitted
Not Permitted FEDR
Permitted
Not Permitted FEDR
Permitted
Only by C2DE FEDR
Not Permitted FEDR
Not Permitted FEDR
Not Permitted FEDR
C2 Debug
Interface
Permitted
Permitted
Permitted
FEDR
an unlocked page a locked page
User Firmware executing from:
Permitted
Permitted
Permitted
Permitted
Permitted
Permitted
FEDR
FEDR
FEDR
FEDR
FEDR
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