SI1000-C-GM Silicon Laboratories Inc, SI1000-C-GM Datasheet - Page 199

IC TXRX MCU + EZRADIOPRO

SI1000-C-GM

Manufacturer Part Number
SI1000-C-GM
Description
IC TXRX MCU + EZRADIOPRO
Manufacturer
Silicon Laboratories Inc
Datasheets

Specifications of SI1000-C-GM

Package / Case
42-QFN
Frequency
240MHz ~ 960MHz
Data Rate - Maximum
256kbps
Modulation Or Protocol
FSK, GFSK, OOK
Applications
General Purpose
Power - Output
20dBm
Sensitivity
-121dBm
Voltage - Supply
1.8 V ~ 3.6 V
Current - Receiving
18.5mA
Current - Transmitting
85mA
Data Interface
PCB, Surface Mount
Memory Size
64kB Flash, 4kB RAM
Antenna Connector
PCB, Surface Mount
Number Of Receivers
1
Number Of Transmitters
1
Wireless Frequency
240 MHz to 960 MHz
Interface Type
UART, SMBus, SPI, PCA
Output Power
20 dBm
Operating Supply Voltage
0.9 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Maximum Supply Current
4.1 mA
Minimum Operating Temperature
- 40 C
Modulation
FSK, GFSK, OOK
Protocol Supported
C2, SMBus
Core
8051
Program Memory Type
Flash
Program Memory Size
64 KB
Data Ram Size
4352 B
Supply Current (max)
4.1 mA
Cpu Family
Si100x
Device Core
8051
Device Core Size
8b
Frequency (max)
25MHz
Total Internal Ram Size
4.25KB
# I/os (max)
22
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8V
On-chip Adc
18-chx10-bit
Instruction Set Architecture
CISC
Mounting
Surface Mount
Pin Count
42
Package Type
QFN EP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Operating Temperature
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1881-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SI1000-C-GM
Manufacturer:
FSC
Quantity:
1 000
Company:
Part Number:
SI1000-C-GM
Quantity:
600
Part Number:
SI1000-C-GMR
Quantity:
6 500
20.2.4. Automatic Gain Control (Crystal Mode Only) and SmaRTClock Bias Doubling
Automatic Gain Control allows the SmaRTClock oscillator to trim the oscillation amplitude of a crystal in
order to achieve the lowest possible power consumption. Automatic Gain Control automatically detects
when the oscillation amplitude has reached a point where it safe to reduce the drive current, therefore, it
may be enabled during crystal startup. It is recommended to enable Automatic Gain Control in most sys-
tems which use the SmaRTClock oscillator in Crystal Mode. The following are recommended crystal spec-
ifications and operating conditions when Automatic Gain Control is enabled:
When using Automatic Gain Control, it is recommended to perform an oscillation robustness test to ensure
that the chosen crystal will oscillate under the worst case condition to which the system will be exposed.
The worst case condition that should result in the least robust oscillation is at the following system condi-
tions: lowest temperature, highest supply voltage, highest ESR, highest load capacitance, and lowest bias
current (AGC enabled, Bias Double Disabled).
To perform the oscillation robustness test, the SmaRTClock oscillator should be enabled and selected as
the system clock source. Next, the SYSCLK signal should be routed to a port pin configured as a push-pull
digital output. The positive duty cycle of the output clock can be used as an indicator of oscillation robust-
ness. As shown in Figure 20.2, duty cycles less than 55% indicate a robust oscillation. As the duty cycle
approaches 60%, oscillation becomes less reliable and the risk of clock failure increases. Increasing the
bias current (by disabling AGC) will always improve oscillation robustness and will reduce the output
clock’s duty cycle. This test should be performed at the worst case system conditions, as results at very
low temperatures or high supply voltage will vary from results taken at room temperature or low supply
voltage.
As an alternative to performing the oscillation robustness test, Automatic Gain Control may be disabled at
the cost of increased power consumption (approximately 200 nA). Disabling Automatic Gain Control will
provide the crystal oscillator with higher immunity against external factors which may lead to clock failure.
Automatic Gain Control must be disabled if using the SmaRTClock oscillator in self-oscillate mode.
Table 20.3 shows a summary of the oscillator bias settings. The SmaRTClock Bias Doubling feature allows
the self-oscillation frequency to be increased (almost doubled) and allows a higher crystal drive strength in
crystal mode. High crystal drive strength is recommended when the crystal is exposed to poor environmen-
tal conditions such as excessive moisture. SmaRTClock Bias Doubling is enabled by setting BIASX2
(RTC0XCN.5) to 1.
ESR < 50 k
Load Capacitance < 10 pF
Supply Voltage < 3.0 V
Temperature > –20 °C
Figure 20.2. Interpreting Oscillation Robustness (Duty Cycle) Test Results
25%
Safe Operating Zone
55%
Low Risk of Clock
Rev. 1.0
Failure
60%
High Risk of Clock
Failure
Si1000/1/2/3/4/5
Duty Cycle
199

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