SI1000-C-GM Silicon Laboratories Inc, SI1000-C-GM Datasheet - Page 79

IC TXRX MCU + EZRADIOPRO

SI1000-C-GM

Manufacturer Part Number
SI1000-C-GM
Description
IC TXRX MCU + EZRADIOPRO
Manufacturer
Silicon Laboratories Inc
Datasheets

Specifications of SI1000-C-GM

Package / Case
42-QFN
Frequency
240MHz ~ 960MHz
Data Rate - Maximum
256kbps
Modulation Or Protocol
FSK, GFSK, OOK
Applications
General Purpose
Power - Output
20dBm
Sensitivity
-121dBm
Voltage - Supply
1.8 V ~ 3.6 V
Current - Receiving
18.5mA
Current - Transmitting
85mA
Data Interface
PCB, Surface Mount
Memory Size
64kB Flash, 4kB RAM
Antenna Connector
PCB, Surface Mount
Number Of Receivers
1
Number Of Transmitters
1
Wireless Frequency
240 MHz to 960 MHz
Interface Type
UART, SMBus, SPI, PCA
Output Power
20 dBm
Operating Supply Voltage
0.9 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Maximum Supply Current
4.1 mA
Minimum Operating Temperature
- 40 C
Modulation
FSK, GFSK, OOK
Protocol Supported
C2, SMBus
Core
8051
Program Memory Type
Flash
Program Memory Size
64 KB
Data Ram Size
4352 B
Supply Current (max)
4.1 mA
Cpu Family
Si100x
Device Core
8051
Device Core Size
8b
Frequency (max)
25MHz
Total Internal Ram Size
4.25KB
# I/os (max)
22
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8V
On-chip Adc
18-chx10-bit
Instruction Set Architecture
CISC
Mounting
Surface Mount
Pin Count
42
Package Type
QFN EP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Operating Temperature
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1881-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SI1000-C-GM
Manufacturer:
FSC
Quantity:
1 000
Company:
Part Number:
SI1000-C-GM
Quantity:
600
Part Number:
SI1000-C-GMR
Quantity:
6 500
5.2.4. Settling Time Requirements
A minimum amount of tracking time is required before each conversion can be performed, to allow the
sampling capacitor voltage to settle. This tracking time is determined by the AMUX0 resistance, the ADC0
sampling capacitance, any external source resistance, and the accuracy required for the conversion. Note
that in low-power tracking mode, three SAR clocks are used for tracking at the start of every conversion.
For many applications, these three SAR clocks will meet the minimum tracking time requirements, and
higher values for the external source impedance will increase the required tracking time.
Figure 5.4 shows the equivalent ADC0 input circuit. The required ADC0 settling time for a given settling
accuracy (SA) may be approximated by Equation 5.1. When measuring the Temperature Sensor output or
V
ments as well as the mux impedance and sampling capacitor values.
Where:
SA is the settling accuracy, given as a fraction of an LSB (for example, 0.25 to settle within 1/4 LSB)
t is the required settling time in seconds
R
n is the ADC resolution in bits (10).
DD
TOTAL
with respect to GND, R
is the sum of the AMUX0 resistance and any external source resistance.
Note: The value of CSAMPLE depends on the PGA Gain. See Table 4.9 for details.
Equation 5.1. ADC0 Settling Time Requirements
TOTAL
Figure 5.4. ADC0 Equivalent Input Circuits
P0.x
t
reduces to R
=
RC
ln
MUX Select
Input
------ -
SA
2
= R
n
MUX
MUX
Rev. 1.0
R
* C
. See Table 4.9 for ADC0 minimum settling time require-
TOTAL
R
MUX
SAMPLE
C
SAMPLE
C
SAMPLE
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