SI1000-C-GM Silicon Laboratories Inc, SI1000-C-GM Datasheet - Page 182

• Manufacturer Part Number: SI1000-C-GM
• Description: IC TXRX MCU + EZRADIOPRO
• Manufacturer: Silicon Laboratories Inc

Specifications of SI1000-C-GM

• Package / Case: 42-QFN
• Frequency: 240MHz ~ 960MHz
• Data Rate - Maximum: 256kbps
• Modulation Or Protocol: FSK, GFSK, OOK
• Applications: General Purpose
• Power - Output: 20dBm
• Sensitivity: -121dBm
• Voltage - Supply: 1.8 V ~ 3.6 V
• Current - Receiving: 18.5mA
• Current - Transmitting: 85mA
• Data Interface: PCB, Surface Mount
• Memory Size: 64kB Flash, 4kB RAM
• Antenna Connector: PCB, Surface Mount
• Number Of Receivers: 1
• Number Of Transmitters: 1
• Wireless Frequency: 240 MHz to 960 MHz
• Interface Type: UART, SMBus, SPI, PCA
• Output Power: 20 dBm
• Operating Supply Voltage: 0.9 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Maximum Supply Current: 4.1 mA
• Minimum Operating Temperature: - 40 C
• Modulation: FSK, GFSK, OOK
• Protocol Supported: C2, SMBus
• Core: 8051
• Program Memory Type: Flash
• Program Memory Size: 64 KB
• Data Ram Size: 4352 B
• Supply Current (max): 4.1 mA
• Cpu Family: Si100x
• Device Core: 8051
• Device Core Size: 8b
• Frequency (max): 25MHz
• Total Internal Ram Size: 4.25KB
• # I/os (max): 22
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 18-chx10-bit
• Instruction Set Architecture: CISC
• Mounting: Surface Mount
• Pin Count: 42
• Package Type: QFN EP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Operating Temperature: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1881-5

Si1000/1/2/3/4/5
19. Clocking Sources
Si1000/1/2/3/4/5 devices include a programmable precision internal oscillator, an external oscillator drive
circuit, a low power internal oscillator, and a SmaRTClock real time clock oscillator. The precision internal
oscillator can be enabled/disabled and calibrated using the OSCICN and OSCICL registers, as shown in
Figure 19.1. The external oscillator can be configured using the OSCXCN register. The low power internal
oscillator is automatically enabled and disabled when selected and deselected as a clock source. SmaRT-
Clock operation is described in the SmaRTClock oscillator chapter.
The system clock (SYSCLK) can be derived from the precision internal oscillator, external oscillator, low
power internal oscillator, or SmaRTClock oscillator. The global clock divider can generate a system clock
that is 1, 2, 4, 8, 16, 32, 64, or 128 times slower that the selected input clock source. Oscillator electrical
specifications can be found in the Electrical Specifications Chapter.
The proper way of changing the system clock when both the clock source and the clock divide value are
being changed is as follows:
If switching from a fast “undivided” clock to a slower “undivided” clock:
1. Change the clock divide value.
2. Poll for CLKRDY > 1.
3. Change the clock source.
If switching from a slow “undivided” clock to a faster “undivided” clock:
1. Change the clock source.
2. Change the clock divide value.
3. Poll for CLKRDY > 1.
182
VDD
Option 2
XTAL2
Option 1
Option 4
10M
XTAL2
Option 3
XTAL2
XTAL1
XTAL2
Figure 19.1. Clocking Sources Block Diagram
OSCICL
Internal Oscillator
Drive Circuit
Oscillator
Precision
External
OSCXCN
EN
OSCICN
Internal Oscillator
Low Power
Rev. 1.0
Low Power Internal Oscillator
Precision Internal Oscillator
smaRTClock
Oscillator
smaRTClock Oscillator
External Oscillator
CLKSEL
Clock Divider
n
CLKRDY
SYSCLK