SI1000-C-GM Silicon Laboratories Inc, SI1000-C-GM Datasheet - Page 41

IC TXRX MCU + EZRADIOPRO

SI1000-C-GM

Manufacturer Part Number
SI1000-C-GM
Description
IC TXRX MCU + EZRADIOPRO
Manufacturer
Silicon Laboratories Inc
Datasheets

Specifications of SI1000-C-GM

Package / Case
42-QFN
Frequency
240MHz ~ 960MHz
Data Rate - Maximum
256kbps
Modulation Or Protocol
FSK, GFSK, OOK
Applications
General Purpose
Power - Output
20dBm
Sensitivity
-121dBm
Voltage - Supply
1.8 V ~ 3.6 V
Current - Receiving
18.5mA
Current - Transmitting
85mA
Data Interface
PCB, Surface Mount
Memory Size
64kB Flash, 4kB RAM
Antenna Connector
PCB, Surface Mount
Number Of Receivers
1
Number Of Transmitters
1
Wireless Frequency
240 MHz to 960 MHz
Interface Type
UART, SMBus, SPI, PCA
Output Power
20 dBm
Operating Supply Voltage
0.9 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Maximum Supply Current
4.1 mA
Minimum Operating Temperature
- 40 C
Modulation
FSK, GFSK, OOK
Protocol Supported
C2, SMBus
Core
8051
Program Memory Type
Flash
Program Memory Size
64 KB
Data Ram Size
4352 B
Supply Current (max)
4.1 mA
Cpu Family
Si100x
Device Core
8051
Device Core Size
8b
Frequency (max)
25MHz
Total Internal Ram Size
4.25KB
# I/os (max)
22
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8V
On-chip Adc
18-chx10-bit
Instruction Set Architecture
CISC
Mounting
Surface Mount
Pin Count
42
Package Type
QFN EP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Operating Temperature
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1881-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SI1000-C-GM
Manufacturer:
FSC
Quantity:
1 000
Company:
Part Number:
SI1000-C-GM
Quantity:
600
Part Number:
SI1000-C-GMR
Quantity:
6 500
4.2. MCU Electrical Characteristics
Table 4.2. Global Electrical Characteristics
–40 to +85 °C, 25 MHz system clock unless otherwise specified. See "AN358: Optimizing Low Power Operation of the
‘F9xx" for details on how to achieve the supply current specifications listed in this table.
Battery Supply Voltage (VBAT) One-Cell Mode
Supply Voltage
(VDD_MCU/DC+)
Minimum RAM Data 
Retention Voltage
SYSCLK (System Clock)
T
T
Specified Operating 
Temperature Range
SYSH
SYSL
(SYSCLK Low Time)
(SYSCLK High Time)
Parameter
1
2
Two-Cell Mode
One-Cell Mode
Two-Cell Mode
VDD (not in Sleep Mode)
VBAT (in Sleep Mode)
Conditions
Rev. 1.0
Si1000/1/2/3/4/5
Min
–40
0.9
1.8
1.8
1.8
18
18
0
Typ
1.2
2.4
1.9
2.4
1.4
0.3
Max
+85
1.8
3.6
3.6
3.6
0.5
25
Units
MHz
°C
ns
ns
V
V
V
41

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