LSISASX12 LSI, LSISASX12 Datasheet - Page 224

• Manufacturer Part Number: LSISASX12
• Manufacturer: LSI

Specifications of LSISASX12

• Lead Free Status / Rohs Status: Not Compliant

Table 5.1
1.
Table 5.2
1.
2.
3.
5-2
V
V
ESD
Symbol Parameter
Symbol
I
V
DD-Core
V
I
DD-Core
DD-Core
DD-I/O
T
DD-IO
DD-IO
These numbers are specified for the design of the I/O power network. Not all of the I
to the LSISASx12 dissipates on-chip.
I
T
STG
T
LP
JA
A
Stresses beyond those listed above can damage the device. These are stress ratings only;
functional operation of the device at or beyond these values is not implied.
Conditions that exceed the operating limits can cause the device to function incorrectly.
Core and analog supply only.
j
HBM
Core and Analog Supply
Voltage
I/O Supply Voltage
Core and Analog Supply
Current (dynamic)
I/O Supply Current
(dynamic)
Junction Temperature
Operating Free Air
Thermal Resistance
(junction to ambient air)
Parameter
Storage Temperature
Supply Voltage
I/O Supply Voltage
Latch-up Current
Electrostatic Discharge -
Human Body Model (HBM)
Absolute Maximum Stress Ratings
Operating Conditions
3
There are no power sequencing requirements for the LSISASx12
expander.
Specifications
Copyright © 2004, 2005 by LSI Logic Corporation. All rights reserved.
2
1
1.14
2.97
Min
–
–
–
–
–
Min
-0.3
-0.3
150
65
–
Nominal
17.8
1.2
3.3
–
–
–
–
1
2000
Max
3.96
150
2.0
–
Max
1.26
3.63
115
90
70
2
–
Unit
mA
Unit
V
V
V
mA
C/W
C
V
V
A
C
C
0 Linear Feet/Minute
FAULT_LED[11:0]/
Test Conditions
Test Conditions
signals asserted
JESD-A114-B
EIA/JESD78
DD-I/O
–
–
–
–
–
–
–
–
supplied