MPC8548E Freescale, MPC8548E Datasheet - Page 126

• Manufacturer Part Number: MPC8548E
• Description: Integrated Processor
• Manufacturer: Freescale

w w w . D a t a S h e e t 4 U . c o m
Thermal
20 Thermal
This section describes the thermal specifications of the MPC8548.
20.1
This section describes the thermal specifications for the HiCTE FC-CBGA package for revision 2.0
silicon.
Table 79
20.2
This section describes the thermal specifications for the FC-PBGA package for revision 2.1.1 silicon.
Table 80
126
Die junction-to-ambient (natural convection)
Die junction-to-ambient (natural convection)
Die junction-to-ambient (200 ft/min)
Die junction-to-ambient (200 ft/min)
Die junction-to-board
Die junction-to-case
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
Die junction-to-ambient (natural convection)
Die junction-to-ambient (natural convection)
Die junction-to-ambient (200 ft/min)
Die junction-to-ambient (200 ft/min)
Die junction-to-board
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
the top surface of the board near the package.
1012.1). The cold plate temperature is used for the case temperature, measured value includes the thermal resistance of the
interface layer.
shows the package thermal characteristics.
shows the package thermal characteristics.
Thermal for Version 2.0 Silicon HiCTE FC-CBGA with Full Lid
Thermal for Version 2.1.1 Silicon FC-PBGA with Full Lid
Characteristic
Characteristic
MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 4
Table 79. Package Thermal Characteristics for HiCTE FC-CBGA
Table 80. Package Thermal Characteristics for FC-PBGA
Four-layer board (2s2p)
Four-layer board (2s2p)
Single-layer board (1s)
Single-layer board (1s)
Four-layer board (2s2p)
Four-layer board (2s2p)
Single-layer board (1s)
Single-layer board (1s)
JEDEC Board
JEDEC Board
N/A
N/A
N/A
Symbol
R
R
R
R
R
Symbol
θ
θ
θ
θ
θ
R
R
R
R
R
R
JA
JA
JA
JA
JB
θ
θ
θ
θ
θ
θ
JC
JA
JA
JA
JA
JB
Value
Value
18
13
13
0.8
9
5
17
12
11
8
3
Freescale Semiconductor
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
Notes
Notes
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
3
4
3