XQ2V3000 Xilinx, XQ2V3000 Datasheet - Page 5

• Manufacturer Part Number: XQ2V3000
• Description: QPro Virtex-II 1.5V Military QML Platform FPGAs
• Manufacturer: Xilinx

Virtex-II Device/Package Combinations and Maximum I/O
Wire-bond and flip-chip packages are available.
shows the maximum possible number of user I/Os in
wire-bond and flip-chip packages.
ber of available user I/Os for all device/package combina-
tions.
•
•
Table 4: Package Information
Table 5: Virtex-II Device/Package Combinations and Maximum Number of Available I/Os
DS122 (v1.1) January 7, 2004
Product Specification
Notes:
1.
2.
Pitch (mm)
Size (mm)
FG denotes wire-bond fine-pitch Plastic BGA (1.00 mm
pitch).
BG denotes wire-bond standard Plastic BGA (1.27 mm
pitch).
The BG728 and CG717 packages are pinout (footprint) compatible.
The CF1144 is pinout (footprint) compatible with the FF1152.
Package
CF1144
BG575
BG728
CG717
FG456
Package
R
Table 5
XQ2V1000
23 x 23
FG456
1.00
324
328
-
-
-
shows the num-
Table 4
www.xilinx.com
1-800-255-7778
31 x 31
BG575
1.27
•
•
The number of I/Os per package include all user I/Os except
the 15 control pins (CCLK, DONE, M0, M1, M2, PROG_B,
PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN,
DXP, and RSVD) and VBATT.
CG denotes wire-bond fine-pitch Hermetic Ceramic
Column Grid Array (1.27 mm pitch).
CF denotes flip-chip fine-pitch non-Hermetic Ceramic
Column Grid Array (1.00 mm pitch).
Available I/Os
XQ2V3000
QPro Virtex-II 1.5V Military QML Platform FPGAs
516
516
-
-
-
BG728 & CG717
35 x 35
1.27
XQ2V6000
824
CF1144
35 x 35
-
-
-
-
1.00
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