XQ2V3000 Xilinx, XQ2V3000 Datasheet - Page 75

• Manufacturer Part Number: XQ2V3000
• Description: QPro Virtex-II 1.5V Military QML Platform FPGAs
• Manufacturer: Xilinx

QPro Virtex-II Device/Package Combinations and Maximum I/Os Available
This section provides
Combinations and Maximum I/Os Available
Virtex-II Pin
following packages:
•
•
•
•
QPro Virtex-II devices are available in both wire-bond and
flip-chip packages. The basic package dimensions are
listed in
more complete mechanical description of each available
package.
Table 72: Package Information
Table 73: QPro Virtex-II Device/Package Combinations and Maximum Number of Available I/Os (Advance
Information)
QPro Virtex-II Pin Definitions
This section describes the pinouts for QPro Virtex-II devices
in the following packages:
•
•
•
•
DS122 (v1.1) January 7, 2004
Product Specification
Notes:
1.
Pitch (mm)
Size (mm)
FG456 Fine-Pitch BGA Package
BG575 Standard BGA Package
BG728 Standard BGA and CG717 Ceramic CGA
Packages
CF1144 Ceramic Flip-Chip Fine-Pitch CGA Package
FG456: wire-bond fine-pitch BGA of 1.00 mm pitch
BG575 and BG728: wire-bond BGA of 1.27 mm pitch
CG717: wire-bond ceramic column grid of 1.27 mm
pitch
CF1144: Ceramic flip-chip fine-pitch column grid of
1.00 mm pitch
The BG728 and CG717 packages are pinout (footprint) compatible.
Package
Table
Package
Table 73
CF1144
BG575
BG728
CG717
FG456
R
Definitions, followed by pinout tables for the
72. See
shows the maximum number of user I/Os
Figure 52
QPro Virtex-II Device/Package
23 x 23
FG456
1.00
through
XQ2V1000
324
328
-
-
-
Figure 56
and
QPro
www.xilinx.com
1-800-255-7778
for a
31 x 31
BG575
1.27
possible for each available package. There are four pack-
age type definitions:
•
•
•
•
The number of I/Os per package include all user I/Os except
the 15 control pins (CCLK, DONE, M0, M1, M2, PROG_B,
PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN,
DXP, AND RSVD).
Each device is split into eight I/O banks to allow for flexibility
in the choice of I/O standards (see the QPro Virtex-II Data
Sheet). Global pins, including JTAG, configuration, and
power/ground pins, are listed at the end of each table.
Table 74
All QPro Virtex-II pinout tables are available on the distribu-
tion CD-ROM, or on the web (at
FG denotes plastic wire-bond fine-pitch BGA (1.00 mm
pitch).
BG denotes plastic wire-bond ball grid array (1.27 mm
pitch).
CG denotes hermetic ceramic wire-bond column grid
array (1.27 mm pitch).
CF denotes non-hermetic ceramic flip-chip column grid
array (1.00 mm pitch).
Available I/Os
XQ2V3000
QPro Virtex-II 1.5V Military QML Platform FPGAs
516
516
provides definitions for all pin types.
-
-
-
BG728 & CG717
35 x 35
1.27
http://www.xilinx.com
XQ2V6000
824
CF1144
35 x 35
-
-
-
-
1.00
).
75