PCM18XT0 Microchip Technology, PCM18XT0 Datasheet - Page 463

• Manufacturer Part Number: PCM18XT0
• Description: MODULE PROC PIC18F4685
• Manufacturer: Microchip Technology

Specifications of PCM18XT0

• Accessory Type: Processor Module
• Product: Microcontroller Modules
• Core Processor: PIC18F4685
• Lead Free Status / RoHS Status: Not applicable / Not applicable
• For Use With/related Products: ICE2000
• For Use With: ICE2000 - EMULATOR MPLAB-ICE 2000 POD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Not applicable / Not applicable

© 2009 Microchip Technology Inc.
44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
PIC18F2682/2685/4682/4685
A1
Dimension Limits
1
2
E
EXPOSED
A
NOTE 1
Units
A1
A3
E2
D2
N
A
E
D
K
e
b
L
PAD
E2
1
2
MIN
0.80
0.00
6.30
6.30
0.25
0.30
0.20
N
MILLIMETERS
0.65 BSC
8.00 BSC
8.00 BSC
0.20 REF
BOTTOM VIEW
NOM
0.90
0.02
6.45
6.45
0.30
0.40
44
Microchip Technology Drawing C04-103B
–
D2
L
MAX
1.00
0.05
6.80
6.80
0.38
0.50
–
DS39761C-page 463
K
e
b