AT91SAM9RL64-CU Atmel, AT91SAM9RL64-CU Datasheet - Page 185
![IC ARM9 MCU 217-LFBGA](/photos/12/13/121366/217-lfbga_sml.jpg)
AT91SAM9RL64-CU
Manufacturer Part Number
AT91SAM9RL64-CU
Description
IC ARM9 MCU 217-LFBGA
Manufacturer
Atmel
Series
AT91SAMr
Specifications of AT91SAM9RL64-CU
Core Processor
ARM9
Core Size
16/32-Bit
Speed
240MHz
Connectivity
EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
AC'97, LCD, POR, PWM, WDT
Number Of I /o
118
Program Memory Size
32KB (32K x 8)
Program Memory Type
ROM
Ram Size
72K x 8
Voltage - Supply (vcc/vdd)
1.08 V ~ 1.32 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
217-LFBGA
Processor Series
AT91SAMx
Core
ARM926EJ-S
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
2-Wire, SPI, SSC, USART
Maximum Clock Frequency
240 MHz
Number Of Programmable I/os
118
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
AT91SAM-ICE, AT91-ISP
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 6 Channel
Controller Family/series
AT91SAM9xxx
No. Of I/o's
118
Ram Memory Size
64KB
Cpu Speed
240MHz
No. Of Timers
1
Rohs Compliant
Yes
Package
217LFBGA
Device Core
ARM926EJ-S
Family Name
91S
Maximum Speed
240 MHz
Operating Supply Voltage
1.8|3.3 V
For Use With
AT91SAM9RL-EK - KIT EVAL FOR AT91SAM9RLAT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
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Price
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22.10.2
Figure 22-22. TDF Optimization: No TDF wait states are inserted if the TDF period is over when the next access begins
22.10.3
6289C–ATARM–28-May-09
D[31:0]
A
NCS0
[25:2]
NWE
MCK
NRD
TDF Optimization Enabled (TDF_MODE = 1)
TDF Optimization Disabled (TDF_MODE = 0)
read access on NCS0 (NRD controlled)
When the TDF_MODE of the SMC_MODE register is set to 1 (TDF optimization is enabled), the
SMC takes advantage of the setup period of the next access to optimize the number of wait
states cycle to insert.
Figure 22-22
NWE, on Chip Select 0. Chip Select 0 has been programmed with:
NRD_HOLD = 4; READ_MODE = 1 (NRD controlled)
NWE_SETUP = 3; WRITE_MODE = 1 (NWE controlled)
TDF_CYCLES = 6; TDF_MODE = 1 (optimization enabled).
When optimization is disabled, tdf wait states are inserted at the end of the read transfer, so that
the data float period is ended when the second access begins. If the hold period of the read1
controlling signal overlaps the data float period, no additional tdf wait states will be inserted.
Figure
with no TDF optimization.
• read access followed by a read access on another chip select,
• read access followed by a write access on another chip select,
• read access followed by a write access on the same chip select,
22-23,
shows a read access controlled by NRD, followed by a write access controlled by
Figure 22-24
NRD_HOLD= 4
TDF_CYCLES = 6
and
Figure 22-25
AT91SAM9R64/RL64 Preliminary
Read to Write
Wait State
illustrate the cases:
NWE_SETUP= 3
write access on NCS0 (NWE controlled)
185
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