AT91SAM9RL64-CU Atmel, AT91SAM9RL64-CU Datasheet - Page 751

• Manufacturer Part Number: AT91SAM9RL64-CU
• Description: IC ARM9 MCU 217-LFBGA
• Manufacturer: Atmel
• Series: AT91SAMr

Specifications of AT91SAM9RL64-CU

• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 240MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: AC'97, LCD, POR, PWM, WDT
• Number Of I /o: 118
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: ROM
• Ram Size: 72K x 8
• Voltage - Supply (vcc/vdd): 1.08 V ~ 1.32 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 217-LFBGA
• Processor Series: AT91SAMx
• Core: ARM926EJ-S
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: 2-Wire, SPI, SSC, USART
• Maximum Clock Frequency: 240 MHz
• Number Of Programmable I/os: 118
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: AT91SAM-ICE, AT91-ISP
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 6 Channel
• Controller Family/series: AT91SAM9xxx
• No. Of I/o's: 118
• Ram Memory Size: 64KB
• Cpu Speed: 240MHz
• No. Of Timers: 1
• Rohs Compliant: Yes
• Package: 217LFBGA
• Device Core: ARM926EJ-S
• Family Name: 91S
• Maximum Speed: 240 MHz
• Operating Supply Voltage: 1.8|3.3 V
• For Use With: AT91SAM9RL-EK - KIT EVAL FOR AT91SAM9RLAT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Figure 41-13. Data OUT Transfer for an Endpoint with Two Banks
41.4.8.13
Figure 41-14. Bank Management, Example of Three Transactions per Microframe
6289C–ATARM–28-May-09
USB Bus
Packets
Virtual RX_BK_RDY
Bank 0
Virtual RX_BK_RDY
Bank 1
RX_BK_RDY = (virtual bank 0 | virtual bank 1)
(UDPHS_EPTSTAx)
FIFO (DPR)
Bank 0
FIFO (DPR)
Bank 1
USB bus
Transactions
Microcontroller FIFO
(DPR) Access
t = 0
High Bandwidth Isochronous Endpoint OUT
Host sends first data payload
Token OUT
Set by Hardware,
Data payload written
in FIFO endpoint bank 0
MDATA0
RX_BK_RDY
Write by UDPHS Device
USB 2.0 supports individual High Speed isochronous endpoints that require data rates up to 192
Mb/s (24 MB/s): 3x1024 data bytes per microframe.
To support such a rate, two or three banks may be used to buffer the three consecutive data
packets. The microcontroller (or the DMA) should be able to empty the banks very rapidly (at
least 24 MB/s on average).
NB_TRANS field in UDPHS_EPTCFGx register = Number Of Transactions per Microframe.
If NB_TRANS > 1 then it is High Bandwidth.
MDATA1
Data OUT 1
Data OUT 1
Read Bank 1
DATA2
ACK
Read by Microcontroller
t = 52.5 µs
(40% of 125 µs)
Set by Hardware
Data Payload written
in FIFO endpoint bank 1
Interrupt pending
Microcontroller reads Data 1 in bank 0,
Host sends second data payload
Data OUT 1
Token OUT
Read Bank 2
AT91SAM9R64/RL64 Preliminary
Write by Hardware
Data OUT 2
Data OUT 2
Cleared by Firmware
Read Bank 3
ACK
t = 125 µs
Token OUT
Read by Microcontroller
Microcontroller reads Data 2 in bank 1,
Host sends third data payload
MDATA0
Interrupt pending
Data OUT 2
RX_BK_RDY
Write in progress
Data OUT 3
Data OUT 3
MDATA1
Read Bank 1
Cleared by Firmware
USB line
DATA2
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