HD64F3437TFI16V Renesas Electronics America, HD64F3437TFI16V Datasheet - Page 537

• Manufacturer Part Number: HD64F3437TFI16V
• Description: MCU FLASH 60K 100-TQFP
• Manufacturer: Renesas Electronics America

Specifications of HD64F3437TFI16V

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

On-Board Programming Modes
Boot Mode
1. Initial state
3. Flash memory initialization
The flash memory is in the erased state when
shipped. The procedure for rewriting an old
version of an application program or data is
described here. The user should prepare an
on-board update routine and the new
application program beforehand in the host.
The erase program in the boot program area (in
RAM) is executed, and the flash memory is
initialized (to H'FF). In boot mode, total flash
memory erasure is performed, without regard to
blocks.
H8/3437SF
H8/3437SF
Flash memory
Flash memory
Flash memory
Boot program
(old version)
Boot program
Application
program
erase
On-board update routine
On-board update routine
New application
New application
program
program
Host
Host
Boot program area
RAM
RAM
Figure 21.3 Boot Mode
SCI
SCI
2. SCI communication check
4. Writing new application program
When boot mode is entered, the boot program
in the H8/3437SF (already incorporated in the
chip) is started, an SCI communication check is
carried out, and the boot program required for
flash memory erasing is automatically
transferred to the RAM boot program area.
The on-board update routine in the host to
RAM is transferred to RAM by SCI
communication and executed, and the new
application program in the host is written into
the flash memory.
H8/3437SF
H8/3437SF
New application
Flash memory
Flash memory
Boot program
Boot program
(old version)
Application
program
program
On-board update routine
New application
program
Host
Host
:
Program execution state
Boot program area
On-board update
routine
RAM
RAM
SCI
SCI
505